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Methods and devices for fabricating and assembling printable semiconductor elements

  • US 8,664,699 B2
  • Filed: 03/13/2013
  • Issued: 03/04/2014
  • Est. Priority Date: 06/04/2004
  • Status: Active Grant
First Claim
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1. An electrical device comprising:

  • a first electrode;

    a second electrode; and

    a printable semiconductor element positioned in electrical contact with said first and second electrodes, said printable semiconductor element comprising a unitary inorganic semiconductor structure and wherein said printable semiconductor element provides a fill factor between said first and second electrodes greater than or equal to about 20%.

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