Strengthened micro-electromechanical system devices and methods of making thereof

• US 8,664,731 B2
• Filed: 02/14/2011
• Issued: 03/04/2014
• Est. Priority Date: 02/14/2011
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: Kionix Incorporated (ROHM Co., Ltd.)
• Inventors: Blackmer, Charles W., Adams, Scott G., Hocking, Andrew S., Lynch, Kristin J., Shah, Ashish A.
• Primary Examiner(s): KUO, WENSING W
• Application Number:
  US13/027,199
• Publication Number:
  US 20120205752A1
• Time in Patent Office: 1,114 Days
• Field of Search: None
• US Class Current: 257/415
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2203/033 Trenches
• CPC Class Codes: B81C 1/00698 Electrical characteristics, e.g. by doping materials
• CPC Class Codes: H01L 21/76232 of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls H01L21/76229 takes precedence

Abstract

In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.

Claims

1. A micro-electromechanical device comprising:

a substrate;

a beam suspended relative to a surface of the substrate, the beam comprising a first beam portion and a second beam portion; and

an isolation joint between the first beam portion and the second beam portion, the isolation joint having a first isolation joint portion, a second isolation joint portion, and a first solid bridge portion, the bridge portion is between the first isolation joint portion and the second isolation joint portion, the first isolation joint portion and the second isolation joint portion each have a seam.

2. The micro-electromechanical device according to claim 1, wherein the first isolation joint portion and the second isolation joint portion each further comprise a void.

3. The micro-electromechanical device according to claim 1, wherein the isolation joint further comprises an additional isolation joint portion having a seam, and an additional solid bridge portion.

4. The micro-electromechanical device according to claim 1, wherein the first bridge portion is adjacent to the first beam portion and the second beam portion.

5. The micro-electromechanical device according to claim 1, wherein the seam of the first isolation joint portion and the seam of the second isolation joint portion are perpendicular to the beam.

6. The micro-electromechanical device according to claim 1, wherein the seam of the first isolation joint portion and the seam of the second isolation joint portion are parallel to the beam.

7. The micro-electromechanical device according to claim 1, wherein the seam of the first isolation joint portion and the seam of the second isolation joint portion have a non-linear shape.

8. The micro-electromechanical device according to claim 7, wherein the non-linear shape is a T-shape.

9. The micro-electromechanical device according to claim 1, wherein each isolation joint portion comprises a dielectric material.

10. The micro-electromechanical device according to claim 9, wherein the dielectric material is silicon dioxide.

11. The micro-electromechanical device according to claim 9, wherein the isolation joint further comprises a filler material in the void of each isolation joint portion.

12. The micro-electromechanical device according to claim 11, wherein the filler material comprises doped or undoped polysilicon.

13. The micro-electromechanical device according to claim 1, wherein the first isolation joint portion and the second isolation joint portion each comprise at least two seams.

14. A computer-program product comprising a non-transitory computer-readable storage medium containing instructions that, if executed on a computing device, define a micro-electromechanical device comprising:

a substrate;

a beam suspended relative to a surface of the substrate, the beam comprising a first beam portion and a second beam portion; and

an isolation joint between the first beam portion and the, second beam portion, the isolation joint comprising a first isolation joint portion, a second isolation joint portion, and a solid bridge portion, the bridge portion is between the first isolation joint portion and the second isolation joint portion, the first isolation joint portion and the second isolation joint portion each having a seam.