Inspection method and inspection apparatus
First Claim
1. A semiconductor device comprising:
- a power supply;
a first conductor electrically connected to the power supply; and
a unit,wherein the first conductor is configured to wirelessly transmit electric power to a second conductor of a device,wherein the unit is configured to monitor electromagnetic wave or electric field generated by the device;
wherein the device includes a plurality of pixels;
wherein each of the plurality of pixels comprises a thin film transistor and a pixel electrode connected to the thin film transistor, andwherein the second conductor is electrically connected to the plurality of pixels.
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Accused Products
Abstract
There is established an easier inspection method with which it is not required to set up probes on wires. Also, there is provided an inspection apparatus using this inspection method. With the inspection apparatus or inspection method, primary coils of an inspection substrate and secondary coils of a device substrate are superimposed on each other so that a certain space is maintained therebetween. An AC signal is inputted into the primary coils, thereby generating an electromotive force in each secondary coil by electromagnetic induction. Then, each circuit provided on the device substrate is driven using the electromotive force and information possessed by an electromagnetic wave or electric field generated in this circuit is monitored, thereby detecting each defective spot.
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Citations
18 Claims
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1. A semiconductor device comprising:
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a power supply; a first conductor electrically connected to the power supply; and a unit, wherein the first conductor is configured to wirelessly transmit electric power to a second conductor of a device, wherein the unit is configured to monitor electromagnetic wave or electric field generated by the device; wherein the device includes a plurality of pixels; wherein each of the plurality of pixels comprises a thin film transistor and a pixel electrode connected to the thin film transistor, and wherein the second conductor is electrically connected to the plurality of pixels. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a power supply; a first conductor electrically connected to the power supply; and a unit, wherein the first conductor is configured to wirelessly transmit electric power to a second conductor or a third conductor of a device, wherein the unit is configured to monitor electromagnetic wave or electric field generated by the device; wherein the device includes a plurality of pixels; wherein each of the plurality of pixels comprises a thin film transistor and a pixel electrode connected to the thin film transistor, and wherein the second conductor is electrically connected to the plurality of pixels. - View Dependent Claims (6, 7, 8)
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9. A semiconductor device comprising:
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a power supply; a first conductor electrically connected to the power supply; a second conductor electrically connected to the power supply; a unit, wherein the first conductor or the second conductor is configured to wirelessly transmit electric power to a third conductor of a device, and wherein the unit is configured to monitor electromagnetic wave or electric field generated by the device. - View Dependent Claims (10, 11, 12, 13)
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14. A semiconductor device comprising:
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a power supply; a first conductor electrically connected to the power supply; a second conductor electrically connected to the power supply; a unit, wherein the first conductor is configured to wirelessly transmit electric power to a third conductor of a device, and wherein the second conductor is configured to wirelessly transmit electric power to a fourth conductor of the device, and wherein the unit is configured to monitor electromagnetic wave or electric field generated by the device. - View Dependent Claims (15, 16, 17, 18)
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Specification