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Inspection method and inspection apparatus

  • US 8,664,967 B2
  • Filed: 03/02/2011
  • Issued: 03/04/2014
  • Est. Priority Date: 03/19/2001
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a power supply;

    a first conductor electrically connected to the power supply; and

    a unit,wherein the first conductor is configured to wirelessly transmit electric power to a second conductor of a device,wherein the unit is configured to monitor electromagnetic wave or electric field generated by the device;

    wherein the device includes a plurality of pixels;

    wherein each of the plurality of pixels comprises a thin film transistor and a pixel electrode connected to the thin film transistor, andwherein the second conductor is electrically connected to the plurality of pixels.

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