Fast recovery reduced p-n junction rectifier

• US 8,669,554 B2
• Filed: 01/11/2012
• Issued: 03/11/2014
• Est. Priority Date: 05/10/2006
• Status: Expired due to Fees

• Current Assignee: Ho-Yuan Yu
• Original Assignee: Ho-Yuan Yu
• Inventors: Yu, Ho-Yuan
• Primary Examiner(s): PERT, EVAN T
• Application Number:
  US13/348,635
• Publication Number:
  US 20120104456A1
• Time in Patent Office: 790 Days
• Field of Search: 257/44, 257/109, 257/483, 257/E29.327, 257/E29.211
• US Class Current: 257/44
• CPC Class Codes: H01L 29/32 the imperfections being within the semiconductor body
• CPC Class Codes: H01L 29/36 characterised by the concentration or distribution of impurities in the bulk material within semiconductor regions H01L29/06
• CPC Class Codes: H01L 29/861 Diodes
• CPC Class Codes: H01L 29/872 Schottky diodes

Abstract

A fast recovery rectifier structure with the combination of Schottky structure to relieve the minority carriers during the forward bias condition for the further reduction of the reverse recovery time during switching in addition to the lifetime killer such as Pt, Au, and/or irradiation. This fast recovery rectifier uses unpolished substrates and thick impurity diffusion for low cost production. A reduced p-n junction structure with a heavily p-type doped thin film is provided to terminate and shorten the p-n junction space charge region. This reduced p-n junction with less total charge in the p-n junction to further improve the reverse recovery time. This reduced p-n junction can be used alone, with the traditional lifetime killer method, with the Schottky structure and/or with the epitaxial substrate.

Claims

1. A rectifier, comprising:

a n-type epitaxial semiconductor substrate;

a plurality of first p-type semiconductor regions disposed in said n-type epitaxial semiconductor substrate;

a second p-type semiconductor layer disposed in said n-type epitaxial semiconductor substrate and separated into a plurality of segments by said plurality of first p-type semiconductor regions, wherein said second p-type semiconductor layer has a smaller depth than each first p-type semiconductor region, wherein said doping concentration of said first p-type semiconductor is higher than said second p-type semiconductor; and

a third p-type semiconductor layer disposed above both said plurality of first p-type semiconductor regions and said second p-type semiconductor layer, wherein said third p-type semiconductor layer has smaller depth than said second p-type semiconductor layer and higher doping concentration than each first p-type semiconductor region.

2. The rectifier of claim 1, wherein the built-in potential of junction between said second p-type semiconductor layer and said n-type epitaxial semiconductor substrate of said rectifier is lower than the built-in potential of a same type of junction without said third p-type semiconductor layer.

3. The rectifier of claim 1, wherein the built-in potential of junction between said second p-type semiconductor layer and said n-type epitaxial semiconductor substrate of said rectifier is lower than the built-in potential of junction between each first p-type semiconductor region and said n-type epitaxial semiconductor substrate of said rectifier.

4. The rectifier of claim 1, wherein said rectifier is a two-node device and current flows through junction of said second p-type semiconductor layer and said n-type epitaxial semiconductor substrate when forward voltage is applied.

5. The rectifier of claim 1, wherein said adjacent first p-type semiconductor regions are separate from each other at a distance at which a depletion layer between said first p-type semiconductor and said n-type epitaxial semiconductor is pinched off when reverse voltage is applied.

6. The rectifier of claim 1, further comprising an edge termination structure at one side of said n-type epitaxial semiconductor substrate, said edge termination structure comprising at least one fourth p-type semiconductor region disposed in said n-type epitaxial semiconductor substrate and an insulation layer disposed above said at least one fourth p-type semiconductor region, wherein said insulation layer and said third p-type semiconductor layer have no overlap.

7. The rectifier of claim 6, further comprising a metal layer disposed above both said third p-type semiconductor layer and said insulation layer, wherein current flows from said metal layer, through said second p-type semiconductor segments, to said n-type epitaxial semiconductor substrate when forward voltage is applied.

8. The rectifier of claim 6, wherein depletion layer of junction between said plurality of first p-type semiconductor regions and said n-type epitaxial semiconductor substrate of said rectifier is extended more than a same type of junction without said edge termination structure when reverse voltage is applied.

9. The rectifier of claim 1, wherein doping concentration of said third p-type semiconductor layer is approximately 1,000 times the doping concentration of said second p-type semiconductor layer.

10. The rectifier of claim 1, wherein depth of said plurality of first p-type semiconductor region is approximately 0.6 um.

11. The rectifier of claim 1, wherein depth of said second p-type semiconductor layer is approximately 0.3 um.

12. The rectifier of claim 1, wherein depth of said third p-type semiconductor layer is approximately 0.1 um or less.

13. A semiconductor device, comprising:

a n-type epitaxial semiconductor substrate;

a plurality of first p-type semiconductor regions disposed in said n-type epitaxial semiconductor substrate;

a second p-type semiconductor layer disposed in said n-type epitaxial semiconductor substrate and separated into a plurality of segments by said plurality of first p-type semiconductor regions, wherein said second p-type semiconductor layer has a smaller depth than each first p-type semiconductor region, wherein said doping concentration of said first p-type semiconductor is higher than said second p-type semiconductor; and

a third p-type semiconductor layer disposed above both said plurality of first p-type semiconductor regions and said second p-type semiconductor layer, wherein said third p-type semiconductor layer has smaller depth than said second p-type semiconductor layer and higher doping concentration than each first p-type semiconductor region.

14. The semiconductor device of claim 13, wherein the built-in potential of junction between said second p-type semiconductor layer and said n-type epitaxial semiconductor substrate of said rectifier is lower than the built-in potential of a same type of junction without said third p-type semiconductor layer.

15. The semiconductor device of claim 13, wherein the built-in potential of junction between said second p-type semiconductor layer and said n-type epitaxial semiconductor substrate of said rectifier is lower than the built-in potential of junction between each first p-type semiconductor region and said n-type epitaxial semiconductor substrate of said rectifier.