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Method for temperature compensation in MEMS resonators with isolated regions of distinct material

  • US 8,669,831 B2
  • Filed: 11/19/2010
  • Issued: 03/11/2014
  • Est. Priority Date: 03/09/2007
  • Status: Active Grant
First Claim
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1. A microelectromechanical system (MEMS) resonator device, comprising:

  • at least one resonating member that includes a first material having one or more trenches defined therein, each of the trenches being at least partially filled with a second material that acts to modify the thermal coefficient of frequency (TCF) of the resonator device;

    where the resonating member has a top surface, a bottom surface, and one or more sidewalls;

    where each of the trenches extends through the first material from the top surface to the bottom surface of the resonator;

    where each of the trenches is isolated by the first material from the sidewalls of the resonator such that no second material filling each trench is present at the sidewalls of the resonator; and

    wherein the second material has a Young'"'"'s modulus temperature coefficient that is different from the Young'"'"'s modulus temperature coefficient of the first material.

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