Cleanup method for optics in immersion lithography with cleaning liquid opposed by a surface of object

• US 8,670,104 B2
• Filed: 03/10/2009
• Issued: 03/11/2014
• Est. Priority Date: 04/11/2003
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Kawai, Hidemi
• Primary Examiner(s): LIU, CHIA HOW MICHAEL
• Application Number:
  US12/382,162
• Publication Number:
  US 20090195762A1
• Time in Patent Office: 1,827 Days
• Field of Search: 355/30, 355/53, 355/67, 359/665
• US Class Current: 355/30
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: B08B 3/12 by sonic or ultrasonic vibrations washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves A47L15/13; of natural teeth, of prostheses using ultrasonic techniques similar to those used for natural teeth A61C17/20; application of ultrasonic vibrations to chemical, physical or physico-chemical processes in general B01J19/10
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70891 Temperature
• CPC Class Codes: G03F 7/70916 Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
• CPC Class Codes: G03F 7/70925 Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Abstract

An immersion lithography apparatus and a cleanup method used for the immersion lithography apparatus in which an immersion liquid is supplied from a liquid supply member to a gap between an optical element of a projection optics and a workpiece during an immersion lithography process. A surface of an object, which is different from the workpiece, is provided such that the surface of the object and the optical element are opposite to each other. During a cleanup process, a cleaning liquid is supplied from the liquid supply member onto the surface of the object.

Claims

1. A method used in an immersion lithography apparatus in which a wafer is exposed through an immersion liquid supplied via a nozzle member during a liquid immersion lithography process, the method comprising:

placing a pad under a projection system for a cleanup process, the pad being different from the wafer and the cleanup process being performed separately from the immersion lithography process; and

supplying, during the cleanup process, a cleaning liquid onto a surface of the pad via the nozzle member, the cleaning liquid being different from the immersion liquid,

wherein;

during the liquid immersion lithography process, a device pattern projection is performed, in which a device pattern image is projected by the projection system through the immersion liquid onto the wafer to fabricate semiconductor devices,

during the cleanup process, the pad is disposed in place of the wafer and the pad is used without performing the device pattern projection,

during the cleanup process, the pad is disposed directly vertically below the nozzle member from which the cleaning liquid is supplied onto the pad from above the pad, and

the wafer is disposed directly vertically below the nozzle member from which the immersion liquid is supplied onto the wafer from above the wafer during the liquid immersion lithography process.

2. The method according to claim 1, wherein the cleaning liquid fills a gap between an optical element of the projection system and the pad in the cleanup process.

3. The method according to claim 1, wherein the pad is provided below a component to be cleaned during the cleanup process.

4. The method according to claim 3, wherein the cleaning liquid is retained between the component to be cleaned and the pad in the cleanup process.

5. The method according to claim 3, wherein the component to be cleaned includes an optical element of the projection system.

6. The method according to claim 1, wherein:

the immersion liquid is supplied through a first channel without passing through a second channel onto the wafer during the liquid immersion lithography process, and

the cleaning liquid is supplied through the second channel without passing through the first channel onto the pad during the cleanup process.

7. A method used in an immersion lithography apparatus in which a wafer is exposed through an immersion liquid supplied via a nozzle member during a liquid immersion lithography process, the method comprising:

placing a pad under the nozzle member for a cleanup process, the pad being different from the wafer and the cleanup process being performed separately from the immersion lithography process; and

supplying, during the cleanup process, a cleaning liquid via the nozzle member onto a surface of the pad, the cleaning liquid being different from the immersion liquid,

wherein

during the cleanup process, the pad is disposed directly vertically below the nozzle member from which the cleaning liquid is supplied onto the pad from above the pad, and

the wafer is disposed directly vertically below the nozzle member from which the immersion liquid is supplied onto the wafer from above the wafer during the liquid immersion lithography process.

8. The method according to claim 7, wherein the pad is provided below a component to be cleaned during the cleanup process.

9. The method according to claim 8, wherein the cleaning liquid is retained between the component to be cleaned and the pad in the cleanup process.

10. The method according to claim 8, wherein a device pattern image is projected onto the wafer by a projection system during the liquid immersion lithography process, and wherein the component to be cleaned includes an optical element of the projection system.

11. The method according to claim 7, wherein:

the immersion liquid is supplied through a first channel without passing through a second channel onto the wafer during the liquid immersion lithography process, and

the cleaning liquid is supplied through the second channel without passing through the first channel onto the pad during the cleanup process.