Optical imaging writer system

• US 8,670,106 B2
• Filed: 05/29/2009
• Issued: 03/11/2014
• Est. Priority Date: 09/23/2008
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Pinebrook Imaging, Inc. (Applied Materials Incorporated)
• Inventors: Chen, Jang Fung, Laidig, Thomas
• Primary Examiner(s): Artman, Thomas R
• Application Number:
  US12/475,114
• Publication Number:
  US 20120264066A1
• Time in Patent Office: 1,747 Days
• Field of Search: 355/46, 355 54- 56, 355/63, 355/67, 355/68, 355/70, 355/77
• US Class Current: 355/46
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70383 Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams maskless lithography using a programmable mask G03F7/70291
• CPC Class Codes: G03F 7/70508 Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
• CPC Class Codes: G03F 7/70791 Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Abstract

System and method for applying mask data patterns to substrate in a lithography manufacturing process are disclosed. In one embodiment, the method includes providing a parallel imaging writer system which has a plurality of spatial light modulator (SLM) imaging units arranged in one or more parallel arrays; receiving a mask data pattern to be written to a substrate, processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate, assigning one or more SLM imaging units to handle each of the partitioned mask data pattern, controlling the plurality of SLM imaging units to write the plurality of partitioned mask data patterns to the substrate in parallel, controlling movement of the plurality of SLM imaging units to cover the different areas of the substrate, and controlling movement of the substrate to be in synchronization with continuous writing of the plurality of partitioned mask data patterns.

Claims

1. A method for applying mask data patterns to substrate in a lithography manufacturing process, comprising:

providing a parallel imaging writer system, wherein the parallel imaging writer system includes a plurality of spatial light modulator (SLM) imaging units arranged in one or more parallel arrays, wherein each one of the plurality of SLM imaging units includes a plurality of illumination sources, one or more alignment sources, one or more projection lenses, and a plurality of micro mirrors configured to project light from the plurality of illumination sources to the corresponding one or more projection lens, and wherein the plurality of illumination sources include a plurality of actinic illumination sources configured to write a mask data pattern to a substrate and a non-actinic illumination source configured to adjust focus of the one of the plurality of SLM imaging units to an area of the substrate, wherein the non-actinic illumination source is located at a center of the plurality of illumination sources;

receiving the mask data pattern to be written to the substrate;

processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate;

assigning one or more SLM imaging units to handle each of the partitioned mask data pattern;

controlling the plurality of SLM imaging units to write the plurality of partitioned mask data patterns to the substrate in parallel;

controlling movement of the plurality of SLM imaging units to cover the different areas of the substrate; and

controlling movement of the substrate to be in synchronization with continuous writing of the plurality of partitioned mask data patterns.

2. The method of claim 1, wherein controlling the plurality of SLM imaging units comprises:

processing the plurality of partitioned mask data patterns automatically from a first design to a second design on the substrate on-the-fly.

3. The method of claim 1, wherein controlling the plurality of SLM imaging units further comprises:

monitoring focus of each SLM imaging units using a non-actinic illumination source; and

adjusting the focus of each SLM imaging unit on-the-fly during exposure.

4. The method of claim 3, wherein monitoring focus of each SLM imaging unit comprises:

capturing images of exposure in progress; and

comparing patterns of captured images to expected exposure patterns to determine amount of defocus.

5. The method of claim 3, wherein monitoring focus of each SLM imaging unit further comprises:

capturing spatial frequencies of images of exposure in progress;

comparing frequency components of captured images to determine amount of defocus.

6. The method of claim 3, wherein monitoring focus of each SLM imaging unit further comprises:

determining focus adjustment direction by varying focus of a SLM imaging unit over a range centered on a target focus position; and

updating the target focus position to balance errors at extremes of the range.

7. The method of claim 3, wherein monitoring focus of each SLM imaging unit further comprises:

determining focus adjustment direction by capturing images from different optical path lengths; and

tuning each SLM imaging unit to a range of depth of focus (DOF) for a predetermined critical dimension.

8. The method of claim 7, wherein determining focus adjustment direction comprises:

using a voting process to control amount of exposure to an area of the substrate in accordance with votes generated based on corresponding masked data patterns.

9. The method of claim 8, wherein the masked data patterns comprise:

isolated patterns surrounding by a dark field; and

isolated patterns surrounding by a clear field.

10. The method of claim 3, wherein adjusting the focus of each SLM imaging unit comprises:

adjusting focus settings to correct overshoots; and

adjusting focus settings to correct undershoots.

11. The method of claim 1, wherein:

physical dimensions of the plurality of SLM imaging units are smaller than physical dimensions of the substrate.

12. The method of claim 1 further comprising:

partitioning the substrate to include different designs having different sizes; and

processing the substrate according to the different designs respectively.

13. A parallel imaging writer system, comprising:

a plurality of spatial light modulator (SLM) imaging units, wherein each one of the plurality of SLM imaging units includes a plurality of illumination sources, one or more alignment sources, one or more projection lenses, and a plurality of micro mirrors configured to project light from the plurality of illumination sources to the corresponding one or more projection lens, and wherein the plurality of illumination sources include a plurality of actinic illumination sources configured to write a mask data pattern to a substrate and a non-actinic illumination source configured to adjust focus of the one of the plurality of SLM imaging units to an area of the substrate, wherein the non-actinic illumination source is located at a center of the plurality of illumination sources; and

a controller configured to control the plurality of SLM imaging units, wherein the controller includes

logic configured to receive the mask data pattern to be written to the substrate;

logic configured to process the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate;

logic configured to assign one or more SLM imaging units to handle each of the partitioned mask data pattern;

logic configured to control the plurality of SLM imaging units to write the plurality of partitioned mask data patterns to the substrate in parallel;

logic configured to control movement of the plurality of SLM imaging units to cover the different areas of the substrate; and

logic configured to control movement of the substrate to be in synchronization with continuous writing of the plurality of partitioned mask data patterns.

14. The parallel imaging writer system of claim 13, wherein logic configured to control the plurality of SLM imaging units comprises:

logic configured to process the plurality of partitioned mask data patterns automatically from a first design to a second design on the substrate on-the-fly.

15. The parallel imaging writer system of claim 13, wherein logic configured to control the plurality of SLM imaging units further comprises:

logic configured to monitor focus of each SLM imaging units using a non-actinic illumination source; and

logic configured to adjust the focus of each SLM imaging unit on-the-fly during exposure.

16. The parallel imaging writer system of claim 15, wherein logic configured to monitor focus of each SLM imaging unit comprises:

logic configured to capture images of exposure in progress; and

logic configured to compare patterns of captured images to expected exposure patterns to determine amount of defocus.

17. The parallel imaging writer system of claim 15, wherein logic configured to monitor focus of each SLM imaging unit further comprises:

logic configured to capture spatial frequencies of images of exposure in progress;

logic configured to compare frequency components of captured images to determine amount of defocus.

18. The parallel imaging writer system of claim 15, wherein logic configured to monitor focus of each SLM imaging unit further comprises:

logic configured to determine focus adjustment direction by varying focus of a SLM imaging unit over a range centered on a target focus position; and

logic configured to update the target focus position to balance errors at extremes of the range.

19. The parallel imaging writer system of claim 15, wherein logic configured to monitor focus of each SLM imaging unit further comprises:

logic configured to determine focus adjustment direction by capturing images from different optical path lengths; and

logic configured to tune each SLM imaging unit to a range of depth of focus (DOF) for a predetermined critical dimension.

20. The parallel imaging writer system of claim 19, wherein logic configured to determine focus adjustment direction comprises:

logic configured to use a voting process to control amount of exposure to an area of the substrate in accordance with votes generated based on corresponding masked data patterns.

21. The parallel imaging writer system of claim 20, wherein the masked data patterns comprise:

isolated patterns surrounding by a dark field; and

isolated patterns surrounding by a clear field.

22. The parallel imaging writer system of claim 15, wherein logic configured to adjust the focus of each SLM imaging unit comprises:

logic configured to adjust focus settings to correct overshoots; and

logic configured to adjust focus settings to correct undershoots.

23. The parallel imaging writer system of claim 13, wherein:

physical dimensions of the plurality of SLM imaging units are smaller than physical dimensions of the substrate.

24. The parallel imaging writer system of claim 13 further comprising:

logic configured to partition the substrate to include different designs having different sizes; and

logic configured to process the substrate according to the different designs respectively.