Fiber monitoring apparatus and system for detecting an optical fiber thermal event

• US 8,670,111 B1
• Filed: 05/31/2012
• Issued: 03/11/2014
• Est. Priority Date: 05/31/2012
• Status: Expired due to Fees

• Current Assignee: Nlight Inc.
• Original Assignee: nLIGHT Corporation
• Inventors: Brown, Aaron, Kiest, Cary S., Reynolds, Mitchell R., Sohn, Raymond
• Primary Examiner(s): Chowdhury, Tarifur
• Assistant Examiner(s): Nixon, Omar
• Application Number:
  US13/485,191
• Time in Patent Office: 649 Days
• Field of Search: 356/73.1
• US Class Current: 356/73.1
• CPC Class Codes: G01K 1/026 arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
• CPC Class Codes: G01K 5/72 with electric transmission means for final indication
• CPC Class Codes: G01M 11/30 Testing of optical devices, constituted by fibre optics or optical waveguides

Abstract

A fiber monitoring system for detecting the occurrence of a thermal event, especially of a traumatic nature, in optical fibers while transmitting laser beams includes one or more fiber monitoring apparatuses each having a thermal sensing array supported by a holder board of a laminated dielectric material having a row of clips for retaining optical fibers in alignment with thermal sensor devices of the thermal sensing arrays. The thermal sensing arrays also have electrical circuitry elements for electrically interconnecting the thermal sensing devices in series and enabling electrically connecting the thermal sensing arrays with other circuitry to form a thermal interlock circuit for a laser system.

Claims

1. A fiber monitoring apparatus, comprising:

a holder body having

a first portion with a plurality of retention elements thereon each arranged next to another and configured to receive and hold an optical fiber such that the optical fibers extend along paths passing through said retention elements and in opposite directions from said holder body, and

a second portion adjacent to said first portion with a plurality of attachment elements thereon configured for enabling the mounting of said holder body on a support structure; and

a thermal sensing array including

a plurality of thermal sensor devices each supported by said second portion of said holder body adjacent to said first portion of said holder body and adjacent to and aligned with the path of at least one of the optical fibers so as to enable said thermal sensor devices to detect changes in temperature corresponding to the occurrence of thermal events in the optical fibers while transmitting laser beams, and

a plurality of electrical circuitry elements supported by said second portion of said holder body so as to electrically interconnect said thermal sensor devices in a series relationship.

2. The apparatus of claim 1, wherein said holder body includes a board made of a non-conductive material, located at said second portion of said holder body and supporting said thermal sensing array.

3. The apparatus of claim 2, wherein said holder body also includes a plurality of connector elements mounting said board to said second portion of said holder body.

4. The apparatus of claim 2, wherein said holder body includes another first portion, said first portions spaced apart from one another and above and below one another so as to provide said retention elements in upper and lower rows thereof, said second portion of said holder body being located between said spaced apart first portions.

5. The apparatus of claim 4, wherein said thermal sensing array is supported by said board such that said thermal sensor devices are spaced apart from one another and arranged as upper and lower rows of thermal sensor devices at two levels, above and below one another, said upper row of thermal sensor devices are aligned with paths of optical fibers passing above said upper row of thermal sensor devices while said lower row of thermal sensor devices are in an inverted relation to said upper row of thermal sensor devices and aligned with paths of optical fibers passing below said lower row of thermal sensor devices.

6. The apparatus of claim 5, wherein said electrical circuitry elements include a plurality of first circuit traces applied on said board adjacent to one another in upper and lower rows spaced below and above said upper and lower retention elements on said first portions of said holder body, said upper row of first circuit traces for electrically interconnecting said thermal sensor devices in said upper row thereof, said lower row of first circuit traces for electrically interconnecting said thermal sensor devices in said lower row thereof.

7. The apparatus of claim 6, wherein said thermal sensor devices have pairs of spaced apart electrically-conductive terminals adapted to mount to said board in electrical contact with spaced apart adjacent opposite ends of adjacent pairs of said circuit traces.

8. The apparatus of claim 7, wherein said electrical circuitry elements also include a second circuit trace applied on said board adjacent corresponding one ends of said upper and lower rows of first circuit traces, said second circuit trace having upper and lower opposite ends matching ends of said upper and lower first circuit traces at said one ends of said upper and lower rows thereof for electrically interconnecting said thermal sensor device at one end of said upper row thereof with said thermal sensor device at one end of said lower row thereof such that said upper and lower rows of thermal sensor devices are electrically connected in a series relation.

9. The apparatus of claim 8, wherein said electrical circuitry elements further include a wiring adapter mounted to said board and electrically connected to ends of said first circuit traces at corresponding other ends of said upper and lower rows of first circuit traces for enabling said thermal sensing array to be electrically connected in series with other circuitry to form a thermal interlock circuit for a laser system.

10. The apparatus of claim 1, wherein each of said thermal sensor devices is a bimetal disc thermostat.

11. The apparatus of claim 1, wherein said holder body is a board made of a non-conductive fire-retardant material.

12. The apparatus of claim 11, wherein said retention elements are upwardly-open clips formed in a row in said first portion of said board.

13. The apparatus of claim 11, wherein said attachments are apertures formed in said second portion of said board.

14. A fiber monitoring apparatus, comprising:

a holder board made of a non-conductive material and having

a first portion with a plurality of retention elements thereon each arranged next to another in a row and configured to receive and hold an optical fiber such that the optical fibers extend along paths passing through said retention elements of and in opposite directions from said holder board, and

a second portion adjacent to said first portion with a plurality of attachment elements thereon configured for enabling the mounting of said holder board on a support structure; and

a thermal sensing array including

a plurality of thermal sensor devices each supported by said second portion of said holder board adjacent to said first portion of said holder board and adjacent to and aligned with the path of at least one of the optical fibers so as to enable said thermal sensor devices to detect changes in temperature corresponding to the occurrence of thermal events in the optical fibers while transmitting laser beams, and

a plurality of electrical circuitry elements supported by said second portion of said holder board so as to electrically interconnect said thermal sensor devices in a series relationship.

15. The apparatus of claim 14, wherein said electrical circuitry elements include a plurality of first circuit traces applied on said holder board adjacent to one another in a row spaced below said retention elements on said first portion of said holder board, each of said first circuit traces having a pair of opposite ends with one of said opposite ends being spaced apart from an adjacent one of said opposite ends of an adjacent one of said first circuit traces.

16. The apparatus of claim 15, wherein each of said thermal sensor devices has a pair of spaced apart electrically-conductive terminals adapted to mount to said holder board in electrical contact with said spaced apart adjacent opposite ends of one pair of said first circuit traces adjacent to said thermal sensor device.

17. The apparatus of claim 16, wherein said electrical circuitry elements also include a pair of second circuit traces applied on said holder board, each of said second circuit traces having a pair of opposite ends with one opposite end spaced from and adjacent to an opposite end of one of said first circuit traces at one of a pair of opposite ends of said row of first circuit traces, said terminals of each of said thermal sensor devices at one of said opposite ends of said row of first circuit traces being in electrical contact with one of said opposite ends of one of said second circuit traces and an adjacent one of said opposite ends of one of said first traces at said one of said opposite ends of said row of first circuit traces.

18. The apparatus of claim 17, wherein said electrical circuitry elements further include a third circuit trace applied on said holder board and having a pair of opposite ends each spaced from and adjacent to one of said opposite ends of one of said pair of second circuit traces.

19. The apparatus of claim 18, wherein said electrical circuitry elements further include a pair of wiring adapters mounted to said board each electrically connected to one of said opposite ends of said third circuit trace and an adjacent one of said opposite ends of one of said pair of second circuit traces for enabling said thermal sensing array to be electrically connected in series with other circuitry to form a thermal interlock circuit for a laser system.

20. The apparatus of claim 14, wherein each of said thermal sensor devices is a bimetal disc thermostat.

21. The apparatus of claim 14, wherein said retention elements are upwardly-open clips formed in a row in said first portion of said holder board.

22. The apparatus of claim 14, wherein said attachments are apertures formed in said second portion of said holder board.

23. The apparatus of claim 14, further comprising:

a supplemental board having

a first portion with a plurality of retention elements thereon each arranged next to another in a row, aligned with one of said retention elements formed in said holder board and configured to receive and hold the optical fiber along paths passing through said retention elements of and in opposite directions from said holder and auxiliary boards, and

a second portion adjacent to and below the said first portion.

24. The apparatus of claim 23, further comprising:

a plurality of connector elements disposed between and interconnecting said holder and supplemental boards to one another at said second portions thereof.

25. The apparatus of claim 23, wherein said supplemental board is made of a non-conductive fire-retardant material.

26. A fiber monitoring system, comprising:

a plurality of monitoring apparatuses, each monitoring apparatus including

a holder board made of a non-conductive material and having

a first portion with a plurality of retention elements thereon each arranged next to another in a row and configured to receive and hold an optical fiber such that the optical fibers extend along paths passing through said retention elements of and in opposite directions from said holder board, and

a second portion adjacent to said first portion with a plurality of attachment elements thereon configured for enabling the mounting of said holder board on a support structure; and

a thermal sensing array including

a plurality of thermal sensor devices each supported by said second portion of said holder board adjacent to said first portion of said holder board and adjacent to and aligned with the path of at least one of the optical fibers so as to enable said thermal sensor devices to detect changes in temperature corresponding to the occurrence of thermal events in the optical fibers while transmitting laser beams, and

a plurality of electrical circuitry elements supported by said second portion of said holder board so as to electrically interconnect said thermal sensing devices in a series relationship; and

electrical wiring extending between said thermal sensing arrays of said plurality of monitoring apparatuses and connected to selected ones of said electrical circuitry elements of said monitoring apparatuses for electrically interconnecting the apparatuses of each sub-pluralities thereof in a series relationship and also electrically interconnecting the sub-pluralities of the apparatuses in a parallel relationship for enabling their electrical connection to other circuitry to form a thermal interlock circuit for a laser system.

27. The system of claim 26 wherein said electrical circuitry elements of each thermal sensing array include a plurality of first circuit traces applied on said holder board adjacent to one another in a row spaced below said retention elements on said first portion of said holder board, each of said first circuit traces having a pair of opposite ends with one of said opposite ends being spaced apart from an adjacent one of said opposite ends of an adjacent one of said first circuit traces.

28. The system of claim 27, wherein each of said thermal sensor devices of each thermal sensing array has a pair of spaced apart electrically-conductive terminals adapted to mount to said holder board in electrical contact with said spaced apart adjacent opposite ends of one pair of said first circuit traces adjacent to said thermal sensor device.

29. The system of claim 28, wherein said electrical circuitry elements of each thermal sensing array also include a pair of second circuit traces applied on said holder board, each of said second circuit traces having a pair of opposite ends with one opposite end spaced from and adjacent to an opposite end of one of said first circuit traces at one of a pair of opposite ends of said row of first circuit traces, said terminals of each of said thermal sensor devices at one of said opposite ends of said row of first circuit traces being in electrical contact with one of said opposite ends of one of said second circuit traces and an adjacent one of said opposite ends of one of said first traces at said one of said opposite ends of said row of first circuit traces.

30. The system of claim 29, wherein said electrical circuitry elements of each thermal sensing array further include a third circuit trace applied on said holder board and having a pair of opposite ends each spaced from and adjacent to one of said opposite ends of one of said pair of second circuit traces.

31. The system of claim 30, wherein said electrical circuitry elements of each thermal sensing array further include a pair of wiring adapters mounted to said board each electrically connected to one of said opposite ends of said third circuit trace and an adjacent one of said opposite ends of one of said pair of second circuit traces for enabling said thermal sensing array to be electrically interconnected in series with other thermal sensing arrays.

32. The system of claim 26, wherein said holder board also incorporates a fire-retardant material.