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Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide

  • US 8,670,638 B2
  • Filed: 09/29/2011
  • Issued: 03/11/2014
  • Est. Priority Date: 09/29/2011
  • Status: Active Grant
First Claim
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1. An integrated circuit formed onto a semiconductor substrate, the semiconductor substrate including a first group and a second group of useable fabrication layers from among a plurality of fabrication layers, the integrated circuit comprising:

  • a functional module formed onto the first group of useable fabrication layers; and

    a leaky waveguide, formed onto the second group of useable fabrication layers, communicatively coupled to the functional module, the leaky waveguide having first and second conductive elements formed on first and second fabrication layers, respectively, from among the second group of useable fabrication layers, the first conductive element having a plurality of phase openings that are configured and arranged to he free of conductive material, the plurality of phase openings and the first and second conductive elements being configured and arranged to form the leaky waveguide.

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