Method and apparatus for cleaning a substrate using non-newtonian fluids

• US 8,671,959 B2
• Filed: 10/04/2011
• Issued: 03/18/2014
• Est. Priority Date: 06/15/2005
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: de Larios, John M., Farber, Jeffrey, Korolik, Mikhail, Redeker, Fred C., Ravkin, Mike
• Primary Examiner(s): GOLIGHTLY, ERIC WAYNE
• Application Number:
  US13/252,859
• Publication Number:
  US 20120017950A1
• Time in Patent Office: 896 Days
• Field of Search: None
• US Class Current: 134/60
• CPC Class Codes: B08B 3/003 Cleaning involving contact with foam
• CPC Class Codes: B08B 7/0014 by incorporation in a layer which is removed with the contaminants
• CPC Class Codes: C11D 2111/22 Electronic devices, e.g. PCBs or semiconductors
• CPC Class Codes: C11D 7/5004 Organic solvents
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

An apparatus for cleaning a substrate includes an application unit having a top inlet conduit and a bottom plate section. The top inlet conduit has an opening for receiving a non-Newtonian fluid and the bottom plate section has an opening through which the non-Newtonian fluid can flow. The bottom plate section is perpendicular to the top inlet conduit, and a surface of the bottom plate section is disposed above and parallel to a surface of a substrate so as to define a gap between the surface of the bottom plate section and the surface of the substrate. The defined gap has a height configured to create a flow of the non-Newtonian fluid in which a portion of the flow exhibits plug flow, and the plug flow moves over the surface of the substrate to remove particles from the surface of the substrate.

Claims

1. An apparatus for cleaning a substrate, comprising:

an application unit having a top inlet conduit and a bottom plate section integrally formed as a single member, the top inlet conduit having an opening for receiving a non-Newtonian fluid and being configured to guide the non-Newtonian fluid toward a surface of a substrate along a first flow path, the bottom plate section having an opening through which the non-Newtonian fluid can flow and being configured to guide the non-Newtonian fluid away from the opening in the bottom plate section and over the surface of the substrate along a second flow path, and the bottom plate section defining an area that is less than an area of the surface of the substrate, the second flow path being perpendicular to the first flow path, and a surface of the bottom plate section being disposed above and parallel to the surface of the substrate so as to define a gap between the surface of the bottom plate section and the surface of the substrate, the gap having a height configured to create a flow of the non-Newtonian fluid in which a portion of the flow exhibits plug flow, and the plug flow moves over the surface of the substrate to remove particles from the surface of the substrate.

2. The apparatus of claim 1, wherein the bottom plate section has a rectangular configuration, a circular configuration, or an oval configuration.

3. The apparatus of claim 1, wherein the gap has a height in a range from 50 microns to 10 millimeters.

4. The apparatus of claim 1, wherein the application unit is configured to remain stationary relative to the substrate during cleaning of the substrate.

5. An apparatus for cleaning a substrate, comprising:

an application unit having a top inlet conduit and a bottom plate section integrally formed as a single member, the top inlet conduit having an opening for receiving a non-Newtonian fluid and being configured to guide the non-Newtonian fluid toward a surface of a substrate along a first flow path, the bottom plate section having an opening through which the non-Newtonian fluid can flow and being configured to guide the non-Newtonian fluid away from the opening in the bottom plate section and over the surface of the substrate along a second flow path, and the bottom plate section defining an area that is less than an area of the surface of the substrate, the second flow path being perpendicular to the first flow path, and a surface of the bottom plate section being disposed above and parallel to the surface of the substrate so as to define a gap between the surface of the bottom plate section and the surface of the substrate, the gap having a height in a range from 50 microns to 10 millimeters.

6. The apparatus of claim 5, wherein the application unit is configured to remain stationary relative to the substrate during cleaning of the substrate.

7. The apparatus of claim 5, wherein the bottom plate section has a rectangular configuration, a circular configuration, or an oval configuration.