Method of fabricating an armor panel

• US 8,673,103 B2
• Filed: 02/03/2012
• Issued: 03/18/2014
• Est. Priority Date: 02/03/2012
• Status: Expired due to Fees

• Current Assignee: U.S. Government
• Original Assignee: The United States Of America As Represented By The Secretary Of The Army
• Inventors: Gendlin, Vladimir, Stanczak, Douglas A., Ostberg, Donald T.
• Primary Examiner(s): Tucker, Philip
• Assistant Examiner(s): WU, VICKI H
• Application Number:
  US13/365,821
• Publication Number:
  US 20130199712A1
• Time in Patent Office: 774 Days
• Field of Search: 156/247
• US Class Current: 156/247
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence
• CPC Class Codes: B32B 2571/02 defensive, e.g. armour plates or anti-ballistic clothing
• CPC Class Codes: B32B 3/12 characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
• CPC Class Codes: B32B 3/18 characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side B32B5/02 takes precedence
• CPC Class Codes: F41H 5/0492 Layered armour containing hard elements, e.g. plates, spheres, rods, separated from each other, the elements being connected to a further flexible layer or being embedded in a plastics or an elastomer matrix

Abstract

A fabricating method for an armor panel uses a template to position tiles on an adhesive surface. The template includes an L-shaped frame and cells having precise wall thickness. Tiles are fitted in the cells against the surface. The template is repeatedly repositioned so new tiles can be fitted into unoccupied cells to form a desired tile array. A border is placed around the array, forming a cavity. Resin is poured into the cavity. A back plate placed over the array presses against the resin. Excess resin exits the cavity through an interface between the border and the adhesive surface and through a gap between the back plate and border. After the resin cures the border is removed.

Claims

1. A method of fabricating a composite armor panel, comprising:

providing an adhesive surface;

placing a template on the adhesive surface, the template having walls defining regular polygonal pockets, the template having an L-shaped frame affixed along two edges of the template, one or more remaining edges of the template comprised of exposed pockets;

fitting tiles closely in the pockets upon the adhesive surface;

removing the template from the tiles so the tiles become free standing tiles having uniform spaces there among;

placing a border on the adhesive surface around the tiles to define a cavity;

placing spacers on the tiles;

pouring resin into the cavity so that the spaces among the tiles are completely filled and the resin'"'"'s level is above the spacers;

placing a plate over the tiles, the plate forming a gap around itself with the border;

passing excess resin through the gap until the plate rests on the spacers;

curing the resin to form an elastomeric matrix embedding the tiles; and

removing the border.

2. The method of claim 1 wherein:

The border has a different degree of flatness than the adhesive surface whereby the border and the adhesive surface form a controlled seepage interface;

the adhesive surface, the border and the plate define a ductless mold cavity;

the method further includes using the plate to press the resin in the cavity to force excess resin from the cavity through the gap between the plate and the border and through the controlled seepage interface; and

the excess resin exits the cavity until the plate contacts the spacers on the tiles.

3. The method of claim 2 wherein:

the resin is poured at ambient pressure and at room temperature; and

the resin in its uncured state has water-like viscosity.

4. A method of fabricating a composite armor panel having a tiled layer, a back plate and an elastomeric layer, comprising:

providing an adhesive surface;

placing a template on the adhesive surface, the template having walls of uniform thickness defining a compact arrangement of polygonal pockets, the template having an L-shaped frame affixed along two edges of the template, one or more remaining edges of the template being comprised of exposed pockets;

fitting first tiles closely in the pockets in contact with the adhesive surface;

removing the template from the first tiles so the first tiles become free standing tiles;

replacing the template on the adhesive surface so that only some of the free standing tiles closely fit in the pockets;

fitting other tiles closely in unoccupied pockets;

removing the template so that all the tiles are free standing tiles having uniform spaces there among;

repeating the steps of replacing the template, fitting the other tiles and removing the template until a final array of tiles is created;

placing a border on the adhesive surface around the final array to form a cavity;

placing spacers on the final array;

pouring polyurethane resin into the cavity so that the spaces among the tiles of the final array are completely filled and the resin'"'"'s level is above the spacers;

placing the back plate over the final array, the back plate forming a gap around itself with the border;

passing excess resin through the gap until the back plate rests upon the spacers whereby a layer of resin is disposed between the final array and the back plate;

curing the resin to form an elastomeric matrix embedding the final array and bonding to the back plate; and

removing the border.

5. The method of claim 4 wherein:

The border has a different degree of flatness than the adhesive surface whereby the border and the adhesive surface form a controlled seepage interface;

the adhesive surface, the border and the back plate define a ductless mold cavity;

the method further includes using the back plate to press the resin in the cavity to force excess resin from the cavity through the gap between the back plate and the border and through the controlled seepage interface; and

the excess resin exits the cavity until the back plate contacts the spacers.

6. The method of claim 5 wherein:

the resin is poured at ambient conditions of temperature and pressure;

the resin in its uncured state has water-like viscosity; and

the resin cures at room temperature.

7. The method of claim 6 wherein the adhesive surface is disposed on an armor plate.

8. A method of fabricating a composite armor panel having a tiled layer, a back plate and an elastomeric layer, comprising:

providing a precisely flat engagement element having an adhesive surface;

placing a template on the adhesive surface, the template having thin walls of precise, constant thickness defining regular polygonal pockets, the template having an L-shaped frame affixed only along two edges of the template so that one or more remaining edges of the template are comprised of exposed pockets;

fitting first tiles closely in the pockets in contact with the adhesive surface;

removing the template from the first tiles so the first tiles are free standing tiles;

replacing the template on the adhesive surface so that only some of the free standing tiles closely fit in the pockets;

fitting other tiles closely in unoccupied pockets;

removing the template from all the tiles so that all the tiles are free standing tiles having precisely wide spaces there among;

repeating the steps of replacing the template, fitting the other tiles and removing the template until a final array of tiles is created;

providing a border with a different degree of flatness from the engagement element and placing the border on the engagement element so as to form a controlled seepage interface there between, wherein the final array is surrounded by the border and is recessed relative to the border;

placing spacers on the final array chemically similar to a polyurethane resin such that the spacers within a body of the resin are indistinguishable from the resin during testing by ultrasonic waves transmitted through the body;

pouring the polyurethane resin, which has water-like viscosity in an uncured state, into the cavity so that the spaces among the tiles of the final array are completely filled and the resin'"'"'s level is above the spacers;

after pouring the resin, placing a back plate over the final array, the back plate forming a gap around itself with the border, wherein the engagement element, the border and the back plate together form a ductless enclosure;

before the resin is completely cured, using the back plate to press upon the resin, passing excess resin through the controlled seepage interface and the gap until the back plate rests upon the spacers whereby a layer of resin is disposed between the final array and the back plate;

curing the resin at ambient temperature and pressure to form an elastomeric matrix embedding the final array and bonding to the back plate; and

removing the border.

9. The method of claim 8 wherein the tiles in the final array have opposed faces precisely coplanar with a pair of parallel planes and sides of the tiles are perpendicular to the opposed faces.

10. The method of claim 9 wherein the engagement element is an armor plate.