Method for forming a connector for an implantable medical device

• US 8,673,194 B2
• Filed: 05/05/2008
• Issued: 03/18/2014
• Est. Priority Date: 05/04/2007
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Lee, Nathan T., Kuschnir, Eugene, Mattson, Jaimie A., Bates, David A.
• Primary Examiner(s): Lee, Edmund H.
• Application Number:
  US12/115,339
• Publication Number:
  US 20080303728A1
• Time in Patent Office: 2,143 Days
• Field of Search: None
• US Class Current: 264/250
• CPC Class Codes: A61N 1/37211 Means for communicating with stimulators
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/273 Adaptation for carrying or wearing by persons or animals
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.

Claims

1. A method comprising:

(a) forming a first shot;

(b) coupling at least one hardware component to the first shot to form a subassembly;

(c) placing the subassembly between a set of opposing areas of a mold;

(d) moving the set of opposing areas of the mold to directly contact and constrain the first shot of the subassembly within the mold with a clamping force; and

(e) introducing a second shot over at least a portion of the subassembly to form an implantable medical device connector.

2. The method of claim 1, wherein the hardware component being an antenna and wherein a dielectric layer is formed over the antenna by the second shot.

3. The method of claim 1, wherein the hardware component is selected from the group consisting of a setscrew block, a multi-beam contact, an interconnect ribbon, an antenna, and a radiopaque identification tag.

4. The method of claim 1, wherein the first shot and the second shot polymer material being the same polymer material.

5. The method of claim 1, wherein the first-shot being formed of an injection molding process.

6. The method of claim 1, wherein the opposed areas of the mold contact the first shot in a location corresponding to a suture hole of the connector.

7. The method of claim 6, wherein the first shot and the second shot being the same thermoplastic material.

8. The method of claim 6, wherein the first shot being formed through an injection molding process.

9. A method comprising:

(a) forming a first component with a portion of a suture hole therethrough;

(b) coupling at least one hardware component to the first component to form a subassembly;

(c) placing the subassembly between a set of opposing areas of a mold, the subassembly having an exposed clamping area;

(d) moving at least one of the set of opposing areas to directly contact the clamping area; and

(e) introducing a second shot over at least a portion of the subassembly to form a second component, the suture hole extending from a portion of the first component through a portion of the second component,

wherein the first and second components form a connector for an implantable medical device,

wherein a knit line delineates an interface between the first and the second components.

10. The method of claim 9, wherein the clamping area is tapered.

11. The method of claim 10 wherein the set of opposing areas of the mold constrain the subassembly in the tapered area of the clamping area.

12. The method of claim 9, wherein a leadbore opening is formed in the connector.

13. The method of claim 12, wherein the suture hole being perpendicular to the leadbore opening.