Methods for forming materials using micro-heaters and electronic devices including such materials
First Claim
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1. A method for forming a material comprising:
- applying energy to a micro-heater to heat the micro-heater;
providing a precursor so as to be in thermal proximity to the micro-heater; and
forming a material from the precursor with the heat from the micro-heater such that the material is formed directly on the micro-heater,wherein the micro-heater includes a substrate, at least one heating element unit on the substrate, a support structure between a portion of the substrate and a portion of the at least one heating element unit, the support structure tapering in width from the substrate to the at least one heating element unit,wherein the at least one heating element unit has a configuration that allows two or more heating element units to be repeatedly connected in series,wherein the at least one heating element unit has at least two first regions and a second region, the second region being located between the first regions, andwherein the support structure is located below a portion of the second region but not below the first regions.
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Abstract
Nano-sized materials and/or polysilicon are formed using heat generated from a micro-heater, the micro-heater may include a substrate, a heating element unit formed on the substrate, and a support structure formed between the substrate and the heating element unit. Two or more of the heating element units may be connected in series.
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Citations
21 Claims
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1. A method for forming a material comprising:
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applying energy to a micro-heater to heat the micro-heater; providing a precursor so as to be in thermal proximity to the micro-heater; and forming a material from the precursor with the heat from the micro-heater such that the material is formed directly on the micro-heater, wherein the micro-heater includes a substrate, at least one heating element unit on the substrate, a support structure between a portion of the substrate and a portion of the at least one heating element unit, the support structure tapering in width from the substrate to the at least one heating element unit, wherein the at least one heating element unit has a configuration that allows two or more heating element units to be repeatedly connected in series, wherein the at least one heating element unit has at least two first regions and a second region, the second region being located between the first regions, and wherein the support structure is located below a portion of the second region but not below the first regions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. The electronic device of 18, further comprising:
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a drain electrode; and a source electrode; wherein the drain electrode and the source electrode intersect on a portion of the substrate at right angles and polysilicon is formed on the drain and source electrodes to form a transistor. - View Dependent Claims (20)
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21. A method for forming a material comprising:
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applying energy to a micro-heater to heat the micro-heater;
providing a precursor so as to be in thermal proximity to the micro-heater; andforming a material from the precursor with the heat from the micro-heater such that the material is formed directly on the micro-heater, wherein the micro-heater includes a substrate, at least one heating element unit on the substrate, a support structure between a portion of the substrate and a portion of the at least one heating element unit, wherein the at least one heating element unit has a configuration that allows two or more heating element units to be repeatedly connected in series, wherein the at least one heating element unit has at least two first regions and a second region, the second region being located between the first regions, wherein the support structure is located below a portion of the second region but not below the first regions, and wherein a size of a top surface of the support structure contacting the at least one heating element unit is different from a size of a bottom surface of the support structure contacting the substrate.
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Specification