Isolation barrier device and methods of use

• US 8,674,486 B2
• Filed: 12/14/2011
• Issued: 03/18/2014
• Est. Priority Date: 12/14/2011
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Haigh, Geoffrey T, Kuhn, Matthew, Melet, Patrick, Pelard, Romain, Chang, Jae Joon, Hur, Youngsik
• Primary Examiner(s): Tran, Thien F
• Application Number:
  US13/325,582
• Publication Number:
  US 20130154071A1
• Time in Patent Office: 825 Days
• Field of Search: None
• US Class Current: 257/676
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/49589 Capacitor integral with or on the leadframe
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate

Abstract

Systems and methods pertaining to a digital signal isolator device are described. In one embodiment, the device includes an isolation barrier and two metal support paddles. The isolation barrier contains an organic and/or a semi-organic insulating material with at least one capacitor embedded inside. One of the two metal support paddles is located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier, while the other metal support paddle is located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.

Claims

1. A digital signal isolator device comprising:

an isolation barrier comprising at least one of an organic or a semi-organic insulating material;

a capacitor comprising a pair of parallel capacitor plates embedded inside the isolation barrier;

a first metal support paddle located below a first portion of a bottom surface of the isolation barrier to provide support to the isolation barrier; and

a second metal support paddle located below a second portion of a bottom surface of the isolation barrier to provide support to the isolation barrier.

2. The device of claim 1, wherein the organic insulating material comprises a polyimide.

3. The device of claim 1, wherein the semi-organic insulating material comprises a silicon-based polymer.

4. The device of claim 1, further comprising:

a first die mounted at a first location on a major surface of the isolation barrier with a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates; and

a second die mounted at a second location on the major surface of the isolation barrier, with a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates.

5. The device of claim 4, further comprising:

a lead frame comprising a plurality of externally-accessible pins of the device;

a third bonding wire providing a third electrically conductive path between a second terminal of the first die and at least one externally-accessible pin of the lead frame; and

a fourth bonding wire providing a fourth electrically conductive path between a second terminal of the second die and at least another externally-accessible pin of the lead frame.

6. The device of claim 1, wherein the first metal support paddle extends beyond a first edge of the isolation barrier, the second metal support paddle extends beyond a second edge of the isolation barrier, and further comprising:

a first die mounted on an extension portion of the first metal support paddle;

a second die mounted on an extension portion of the second metal support paddle;

a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates embedded inside the isolation barrier; and

a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates embedded inside the isolation barrier.

7. The device of claim 6, further comprising:

a lead frame comprising a plurality of externally-accessible pins of the device;

a third bonding wire providing a third electrically conductive path between a second terminal of the first die and at least one externally-accessible pin of the lead frame; and

a fourth bonding wire providing a fourth electrically conductive path between a second terminal of the second die and at least another externally-accessible pin of the lead frame.

8. A digital signal isolator device comprising:

a first metal support paddle;

a second metal support paddle that is electrically isolated from the first metal support paddle;

an isolation barrier comprising at least one of an organic or a semi-organic insulating material, the isolation barrier having a first portion supported by the first metal support paddle and a second portion supported by the second metal support paddle;

a pair of parallel capacitor plates embedded inside the isolation barrier;

a first die mounted at a first location on a major surface of the isolation barrier with a first bonding wire providing a first electrically conductive path between a first terminal of the first die and a first plate of the pair of parallel capacitor plates; and

a second die mounted at a second location on the major surface of the isolation barrier, with a second bonding wire providing a second electrically conductive path between a first terminal of the second die and a second plate of the pair of parallel capacitor plates.

9. The device of claim 8, wherein the first metal support paddle includes a first externally-accessible pin of the device, and the second metal support paddle includes a second externally-accessible pin of the device.