IC card and booking-account system using the IC card

• US 8,674,493 B2
• Filed: 09/14/2012
• Issued: 03/18/2014
• Est. Priority Date: 12/27/2002
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Takayama, Toru, Maruyama, Junya, Goto, Yuugo, Ohno, Yumiko, Akiba, Mai
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): TAYLOR, EARL N
• Application Number:
  US13/618,384
• Publication Number:
  US 20130015441A1
• Time in Patent Office: 550 Days
• Field of Search: 257/679, 257/E23.064, 349/152
• US Class Current: 257/679
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07703 the interface being visual
• CPC Class Codes: G06Q 20/105 involving programming of a portable memory device, e.g. IC cards, "electronic purses"
• CPC Class Codes: G06Q 20/3415 Cards acting autonomously as pay-media
• CPC Class Codes: G07F 7/1008 Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/10271 Silicon-germanium [SiGe]
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm.

Claims

1. A semiconductor device comprising:

a substrate;

an integrated circuit over the substrate;

a connection terminal over the integrated circuit; and

a display device over the substrate with an adhesive agent therebetween, the display device comprising;

a base film over the substrate; and

a semiconductor element over the base film;

wherein the integrated circuit is electrically connected to the connection terminal,

wherein the integrated circuit is electrically connected to the display device, and

wherein the connection terminal is exposed.

2. The semiconductor device according to claim 1, wherein the substrate comprises polyimide.

3. The semiconductor device according to claim 1, wherein the substrate is a printed wiring board.

4. The semiconductor device according to claim 1, wherein the semiconductor element comprises a polycrystalline semiconductor.

5. The semiconductor device according to claim 1, wherein the display device is a liquid crystal display device or a light emitting device.

6. An IC card comprising the semiconductor device according to claim 1, wherein a surface of the IC card is curved.

20. The semiconductor device according to claim 1,

wherein the display device further comprises an insulating layer comprising oxygen, and

wherein the base film is over the insulating layer.

7. A semiconductor device comprising:

a substrate;

an integrated circuit over the substrate;

a connection terminal over the integrated circuit; and

a display device over the substrate with an adhesive agent therebetween, the display device comprising;

an insulating layer comprising oxygen;

a base film over the insulating layer; and

a semiconductor element over the base film;

wherein a film comprising metal and oxygen is attached to a part of the insulating layer,

wherein the integrated circuit is electrically connected to the connection terminal,

wherein the integrated circuit is electrically connected to the display device, and

wherein the connection terminal is exposed.

8. The semiconductor device according to claim 7, wherein the film comprising metal and oxygen comprises tungsten.

9. The semiconductor device according to claim 7, wherein the substrate comprises polyimide.

10. The semiconductor device according to claim 7, wherein the substrate is a printed wiring board.

11. The semiconductor device according to claim 7, wherein the semiconductor element comprises a polycrystalline semiconductor.

12. The semiconductor device according to claim 7, wherein the display device is a liquid crystal display device or a light emitting device.

13. An IC card comprising the semiconductor device according to claim 7, wherein a surface of the IC card is curved.

14. A semiconductor device comprising:

a substrate;

an integrated circuit over the substrate;

an antenna electrically connected to the integrated circuit; and

a display device over the substrate with an adhesive agent therebetween, the display device comprising;

a base film over the substrate; and

a semiconductor element over the base film;

wherein the integrated circuit is electrically connected to the display device.

15. The semiconductor device according to claim 14, wherein the substrate comprises polyimide.

16. The semiconductor device according to claim 14, wherein the substrate is a printed wiring board.

17. The semiconductor device according to claim 14, wherein the semiconductor element comprises a polycrystalline semiconductor.

18. The semiconductor device according to claim 14, wherein the display device is a liquid crystal display device or a light emitting device.

19. An IC card comprising the semiconductor device according to claim 14, wherein a surface of the IC card is curved.

21. The semiconductor device according to claim 14,

wherein the display device further comprises an insulating layer comprising oxygen, and

wherein the base film is over the insulating layer.