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Package systems having a eutectic bonding material and manufacturing methods thereof

  • US 8,674,495 B2
  • Filed: 02/25/2011
  • Issued: 03/18/2014
  • Est. Priority Date: 10/08/2010
  • Status: Active Grant
First Claim
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1. A package system comprising:

  • a first substrate;

    a second substrate electrically coupled with the first substrate; and

    at least one electrical bonding material disposed between the first substrate and the second substrate, the at least one electrical bonding material including a eutectic bonding material, the eutectic bonding material including a metallic material and a semiconductor material, the metallic material being disposed adjacent to a surface of the first substrate, wherein the eutectic bonding material includes a first pad and at least one first guard ring around the first pad.

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