Semiconductor device and method of manufacture thereof
First Claim
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1. A semiconductor device comprising:
- a first semiconductor chip comprising a first coil;
an isolating film disposed on the first semiconductor, wherein the isolating film is a double sided adhesive film having a dielectric strength between 60 kV/mm and 100 kV/mm; and
a second semiconductor chip comprising a second coil, the second semiconductor chip disposed on the isolating film and the second coil configured to be inductively coupled to the first coil.
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Abstract
A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.
16 Citations
23 Claims
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1. A semiconductor device comprising:
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a first semiconductor chip comprising a first coil; an isolating film disposed on the first semiconductor, wherein the isolating film is a double sided adhesive film having a dielectric strength between 60 kV/mm and 100 kV/mm; and a second semiconductor chip comprising a second coil, the second semiconductor chip disposed on the isolating film and the second coil configured to be inductively coupled to the first coil. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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a leadframe; a first semiconductor chip disposed on the leadframe and comprising a first coil; a second semiconductor chip comprising a second coil aligned with the first coil, the second semiconductor chip disposed on the first semiconductor chip; an isolating film between the first semiconductor chip and the second semiconductor chip, wherein the isolating film is an attach paste having a dielectric strength between 60 kV/mm and 100 kV/mm; and an encapsulation material encapsulating the first semiconductor chip, the second semiconductor chip and the leadframe. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A semiconductor device comprising:
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a leadframe; a coreless transformer disposed on the leadframe, the coreless transformer comprising a first semiconductor chip with a first coil; a second semiconductor chip with a second coil; and an isolating film between the first semiconductor chip and the second semiconductor chip, wherein the isolating film is an attach paste having a dielectric strength between 60 kV/mm and 100 kV/mm; and an encapsulation material encapsulating the coreless transformer and the leadframe. - View Dependent Claims (18)
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19. A semiconductor device comprising:
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a first semiconductor chip comprising a first coil; an isolating film disposed on the first semiconductor, wherein the isolating film is an attach paste having a dielectric strength between 60 kV/mm and 100 kV/mm; and a second semiconductor chip comprising a second coil, the second semiconductor chip disposed on the isolating film and the second coil configured to be inductively coupled to the first coil.
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20. A semiconductor device comprising:
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a leadframe; a first semiconductor chip disposed on the leadframe and comprising a first coil; a second semiconductor chip comprising a second coil aligned with the first coil, the second semiconductor chip disposed on the first semiconductor chip; an isolating film between the first semiconductor chip and the second semiconductor chip, wherein the isolating film is a double sided adhesive film having a dielectric strength between 60 kV/mm and 100 kV/mm; and an encapsulation material encapsulating the first semiconductor chip, the second semiconductor chip and the leadframe. - View Dependent Claims (21, 22)
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23. A semiconductor device comprising:
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a leadframe; a coreless transformer disposed on the leadframe, the coreless transformer comprising a first semiconductor chip with a first coil; a second semiconductor chip with a second coil; and an isolating film between the first semiconductor chip and the second semiconductor chip, wherein the isolating film is a double sided adhesive film having a dielectric strength between 60 kV/mm and 100 kV/mm; and an encapsulation material encapsulating the coreless transformer and the leadframe.
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Specification