Antenna using through-silicon via
First Claim
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1. An antenna comprising:
- a substrate;
a top plate disposed over the substrate;
at least one feed line connected to the top plate, each feed line comprising a first through-silicon via (TSV) structure passing through the substrate; and
at least one ground line connected to the top plate, each ground line comprising a second TSV structure passing through the substrate,wherein the top plate is electrically conductive, the at least one feed line is arranged to carry a radio frequency signal, and the at least one ground line is arranged to be coupled to a ground.
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Abstract
An antenna includes a substrate and a top plate disposed over the substrate. At least one feed line is connected to the top plate, and each feed line comprises a first through-silicon via (TSV) structure passing through the substrate. At least one ground line is connected to the top plate, and each ground line comprises a second TSV structure passing through the substrate. The top plate is electrically conductive, and the at least one feed line is arranged to carry a radio frequency signal. The at least one ground line is arranged to be coupled to a ground.
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Citations
20 Claims
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1. An antenna comprising:
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a substrate; a top plate disposed over the substrate; at least one feed line connected to the top plate, each feed line comprising a first through-silicon via (TSV) structure passing through the substrate; and at least one ground line connected to the top plate, each ground line comprising a second TSV structure passing through the substrate, wherein the top plate is electrically conductive, the at least one feed line is arranged to carry a radio frequency signal, and the at least one ground line is arranged to be coupled to a ground. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of implementing an antenna comprising:
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forming a first through-silicon via (TSV) through a substrate for a feed line of the antenna; forming a second TSV through the substrate for a ground line of the antenna; and forming a top plate of the antenna over the substrate, wherein the top plate is electrically conductive and connected to the first TSV and the second TSV. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. An antenna comprising:
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a substrate; a top plate disposed over the substrate; a ground plate disposed below the substrate; at least one feed line connected to the top plate, each feed line comprising a first through-silicon via (TSV) structure passing through the substrate; and at least one ground line connected to the top plate, each ground line comprising a second TSV structure passing through the substrate, wherein the top plate is electrically conductive, the at least one feed line is arranged to carry a radio frequency signal, the at least one feed line is coupled to another die stacked below the substrate in a 3-dimensional (3D) packaging using the first TSV structure, and the at least one ground line is arranged to be coupled to the ground plate.
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Specification