Lithographic apparatus and device manufacturing method

• US 8,675,175 B2
• Filed: 03/08/2013
• Issued: 03/18/2014
• Est. Priority Date: 05/30/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: George, Richard Alexander, Gui, Cheng-Qun, De Jager, Pieter Willem Herman, Van Leeuwen, Robbert Edgar, Burghoorn, Jacobus
• Primary Examiner(s): Ton, Toan
• Assistant Examiner(s): KREUTZER, COLIN WRIGHT
• Application Number:
  US13/791,477
• Publication Number:
  US 20130201466A1
• Time in Patent Office: 375 Days
• Field of Search: 2502011-2012, 250/492.2, 250/548, 355/53, 355/55, 355 67- 68, 355/72, 355/75, 355/77, 356399-401, 356614-624, 430/30, 430311-313
• US Class Current: 355/67
• CPC Class Codes: G03B 27/53 Automatic registration or positioning of originals with respect to each other or the photosensitive layer
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70791 Large workpieces, e.g. glass substrates for flat panel displays or solar panels
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment
• CPC Class Codes: G03F 9/7026 Focusing

Abstract

A lithography apparatus includes a projection system configured to project a radiation beam onto a substrate, a detector configured to inspect the substrate, and a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector. The detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.

Claims

1. A lithography apparatus comprising:

a projection system comprising a plurality of projection optics arranged in a direction across a substrate, each of the projection optics for projecting a radiation beam onto a substrate;

a detector unit for inspecting the substrate comprising a plurality of detectors arranged in the direction such that each detector in the plurality of detectors is aligned with an associated projection optic in the plurality of projection optics; and

a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector unit;

wherein each detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam projected by the associated projection optic.

2. The apparatus of claim 1, wherein the plurality of detectors are arranged to simultaneously inspect a plurality of portions of the substrate across the full width of the substrate.

4. The apparatus of claim 1, wherein the apparatus is configured to provide a patterned beam using an array of individually controllable elements.

5. The apparatus of claim 4, wherein the apparatus comprises a plurality of arrays of individually controllable elements.

3. The apparatus of claim I, further comprising a controller for adjusting exposure conditions based on said inspecting.

6. A device manufacturing method comprising:

moving a substrate relative to a projection system comprising a plurality of projection optics arranged in a direction across the substrate and a detector unit comprising a plurality of detectors arranged in the direction such that each detector in the plurality of detector is aligned with an associated projection optic in the plurality of projection optics;

inspecting a portion of the substrate using each of the detectors; and

exposing the portion of the substrate using each of the associated projection optics while the exposure conditions are adjusted according to the inspection.

7. The method of claim 6, wherein the inspecting and the exposing occurs while moving the substrate.

8. The method of claim 6, wherein moving the substrate relative to the projection system and the detector unit occurs between consecutive exposures.

9. The method of claim 6, wherein moving the substrate relative to the projection system and the detector unit occurs during continuous exposure.

10. The method of claim 6, wherein the portion of the substrate being inspected subsequently becomes the portion of the substrate being exposed.

11. The method of claim 6, wherein the exposure conditions are adjusted to optimize for overlay accuracy.

12. The method of claim 6, wherein the substrate moves at a substantially constant velocity relative to the projection system and the detector unit.

13. The method of claim 6, wherein the position of the detectors relative to the projection system is substantially fixed and known.

14. The method of claim 6, further comprising monitoring the position of the detectors relative to the projection system during exposure.

15. The method of daub 6, wherein the portion of the substrate comprises the full width of the substrate.