Heat exchangers and related methods

• US 8,678,075 B2
• Filed: 12/01/2009
• Issued: 03/25/2014
• Est. Priority Date: 01/06/2009
• Status: Active Grant

• Current Assignee: Massachusetts Institute of Technology
• Original Assignee: Massachusetts Institute of Technology
• Inventors: Wang, Evelyn N., Brisson, John G., Jacobson, Stuart A., Lang, Jeffrey H., McCarthy, Matthew
• Primary Examiner(s): Flanigan, Allen
• Assistant Examiner(s): THOMPSON, JASON N
• Application Number:
  US12/628,331
• Publication Number:
  US 20100170660A1
• Time in Patent Office: 1,575 Days
• Field of Search: 165/104.33, 165/121, 165/146, 165/104.26, 361/696, 361/697, 361/700
• US Class Current: 165/80.2
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Heat exchanger. The heat exchanger includes a thermal contact plate defining a cavity in fluid communication with a first pipe and a plurality of stationary elements substantially perpendicular to the first pipe each defining a cavity wherein each cavity is in fluid communication with the first pipe and at least one cavity includes a wick. A plurality of movable elements are provided wherein the movable elements and the stationary elements are substantially parallel, alternatingly arranged and a portion of the movable elements overlaps a portion of the stationary elements. A working fluid is provided in the first pipe and cavities or stationary elements and thermal contact plate.

Claims

1. A device comprising:

a thermal contact plate defining a cavity in fluid communication with first and second pipes;

a plurality of stationary elements substantially perpendicular to the first pipe that carries predominantly vaporized working fluid, each stationary element defining a cavity, wherein each cavity is in fluid communication with the first pipe, and at least one cavity comprises a wick;

a second pipe in fluid communication with the cavities in the stationary elements that carries predominantly liquid working fluid back to the thermal contact plate cavity wherein the wick is also located throughout the second pipe, and not located in the first pipe;

a plurality of movable elements, wherein the moveable elements and the stationary elements are substantially parallel, alternatingly arranged, and a portion of the movable elements overlaps a portion of the stationary elements; and

a working fluid in the first and second pipes and cavities, or in the stationary elements and thermal contact plate.

2. The device of claim 1, wherein the wick comprises sintered particles.

3. The device of claim 1, wherein the wick comprises a series of pillars with a height in the range of approximately 10 μ

m to approximately 100 μ

m, a width in the range of approximately 500 nm to approximately 50 μ

m and a length in the range of approximately 500 nm to approximately 50 μ

m and a pitch in the range of approximately 500 nm to approximately 50 μ

m.

4. The device of claim 1, having a total volume of not more than about 64 cubic inches.

5. The device of claim 1, having overall dimensions in the range of about 5 cm to about 10 cm, by about 5 cm to about 10 cm, by about 5 cm to about 10 cm.

6. The device of claim 1, wherein the stationary element, movable element, thermal contact plate, or heat pipe comprises a material selected from the group consisting of copper, aluminum, silicon, graphite, steel, stainless steel, titanium, diamond, silver, graphene, alloys thereof and combinations thereof.

7. The device of claim 1, wherein the working fluid is selected from the group consisting of water, ammonia, methanol, ethanol, and combinations thereof.

8. The device of claim 1, wherein the working fluid has a vaporization temperature in the range of from approximately 40°

C. to approximately 150°

C.

9. The device of claim 1 wherein the stationary element and associated pipe sections are constructed from a monoblock.

10. The device of claim 1, wherein the pipe has a diameter of less than about 1 mm.

11. The device of claim 1, wherein the pipe has a diameter of less than about 5 mm.

12. The device of claim 1, having an overall thermal resistivity less than about 0.5 K/W.

13. The device of claim 1, wherein the device can dissipate between about 0.25 kW to about 1 kW of heat.