Progressive trimming method

• US 8,679,944 B2
• Filed: 07/31/2009
• Issued: 03/25/2014
• Est. Priority Date: 09/02/2008
• Status: Active Grant

• Current Assignee: Soitec S.A.
• Original Assignee: Soitec S.A.
• Inventors: Broekaart, Marcel, Migette, Marion, Neyret, Eric, Molinari, Sbastien
• Primary Examiner(s): Loke, Steven
• Assistant Examiner(s): GOODWIN, DAVID J
• Application Number:
  US12/934,026
• Publication Number:
  US 20110097874A1
• Time in Patent Office: 1,698 Days
• Field of Search: 438/455, 438/459
• US Class Current: 438/459
• CPC Class Codes: H01L 21/304 Mechanical treatment, e.g. grinding, polishing, cutting H01L21/30625 takes precedence
• CPC Class Codes: H01L 21/76256 using silicon etch back techniques, e.g. BESOI, ELTRAN
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provides a method of trimming a structure that includes a first wafer bonded to a second wafer, with the first wafer having a chamfered edge. The method includes a first trimming step carried out over a first depth that includes at least the thickness of the first wafer and over a first width determined from the edge of the first wafer. A second trimming step is then carried out over a second depth that includes at least the thickness of the first wafer and over a second width that is less than the first width.

Claims

1. A method of reducing applied mechanical friction when trimming a bonded structure comprising a first wafer of predetermined thickness and comprising electrical components, bonded to a second wafer of predetermined thickness, with the first wafer having a chamfered edge, which method comprises:

a first trimming step carried out by mechanical action upon the bonded structure and over a first depth comprising the thickness of the first wafer and a first portion of the thickness of the second wafer, and also being carried out over a first predetermined width from the edge of the first wafer; and

at least one second trimming step also carried out by mechanical action upon the bonded structure and over a second depth also comprising the thickness of the first wafer and a second portion of the thickness of the second wafer, while being carried out over a second predetermined width that is less than the first width and also is further from the edge of first wafer than is the first predetermined width.

2. The method according to claim 1, wherein the second depth is less than the first depth and wherein both trimming steps produce a wafer edge having a surface which is perpendicular to a top or bottom surface of either wafer.

3. The method according to claim 1, wherein the portion of the thickness of the second wafer withdrawn during the first trimming step is in the range of 10 μ

m to 30 μ

m.

4. The method according to claim 1, wherein the portion of the thickness of the second wafer withdrawn during the second trimming step is in an amount of up to 10 μ

m.

5. The method according to claim 1, wherein the first trimming step is carried out over a first width in the range 2 mm to 10 mm for a wafer having a diameter of between 100 and 300 mm.

6. The method according to claim 5, wherein the second trimming step is carried out over a second width in the range of 0.1 mm to 2 mm.

7. The method according to claim 1, wherein at least one of the trimming steps is carried out with a grinder comprising grooves on its lower surface to produce a trimming surface having inwardly curved flanks.

8. The method of claim 2 wherein the width removed by the first trimming step does not remove any of the electrical components.

9. A method of producing a three-dimensional composite structure which comprises

at least one step of producing a first layer of electrical components on one face of a first wafer, with the first wafer having a predetermined thickness,

a step of bonding the face of the first wafer comprising the layer of electrical components onto a second wafer to form a bonded structure, with the second wafer having a predetermined thickness, and

a step of trimming the first wafer and a portion of the thickness of the second wafer, by performing a method which reduces mechanical friction applied thereto, the trimming step comprising:

a first trimming sub-step carried out upon the bonded structure by mechanical action and over a first depth comprising the thickness of the first wafer and a first portion of the thickness of the second wafer, and also being carried out over a first predetermined width from an edge of the first wafer, and

at least one second trimming sub-step also carried out upon the bonded structure by mechanical action and over a second depth also comprising the thickness of the first wafer and a second portion of the thickness of the second wafer, while being carried out over a second predetermined width that is less than the first width and also is further from the edge of first wafer than is the first predetermined width.

10. The method according to claim 9, which further comprises a step of thinning the first wafer is conducted after bonding.

11. The method according to claim 9, which further comprises a step of producing a second layer of electrical components on the face of the first wafer opposite to the face comprising the first layer of electrical components.

12. The method according to claim 9, which further comprises a step of forming a layer of oxide on the face of the first wafer comprising the first layer of electrical components before bonding.

13. The method according to claim 9, wherein the first wafer is a SOI type structure.

14. The method according to claim 9, wherein at least the first layer of electrical components comprises image sensors.

15. The method of claim 9 wherein the width removed by the first trimming does not remove any of the electrical components.

16. In a method of trimming a layer of a bonded structure by mechanical machining, wherein the structure comprises a first wafer of predetermined thickness and comprising electrical components, bonded to a second wafer of predetermined thickness, the improvement which comprises:

conducting a first mechanical machining of the first wafer of the bonded structure over a first predetermined depth comprising the thickness of the first wafer and a first portion of the thickness of the second wafer, and also being carried out over a first predetermined width from the edge of the first wafer; and

conducting a second mechanical machining of the first wafer of the bonded structure over a second depth also comprising the thickness of the first wafer and a second portion of the thickness of the second wafer while being carried out over a second width that is less than the first width and also is further from the edge of first wafer than is the first predetermined width.

17. The method of claim 16 wherein the width removed by the first mechanical machining step does not remove any of the electrical components.