Microdisplay packaging system
First Claim
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1. A device comprising:
- a microdisplay integrated circuit (IC);
a substantially transparent protective cover coupled to the microdisplay IC; and
a chip carrier defining an opening,wherein the microdisplay IC comprises;
a semiconductor substrate;
a pixel cell array fabricated within upper layers of semiconductor substrate, the pixel cell array including a plurality of pixel cells arranged in a two-dimensional grid;
a plurality of pixel electrodes, each associated with a respective one of the plurality of pixel cells;
a light switching layer in contact with the plurality of pixel electrodes; and
an electrode disposed between the light switching layer and the substantially transparent protective cover; and
wherein the cover extends over the plurality of pixel cells and partially into, fully into, partially through or fully through the opening defined by the chip carrier; and
wherein the chip carrier comprises conductors to carry electrical signals.
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Abstract
Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.
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Citations
11 Claims
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1. A device comprising:
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a microdisplay integrated circuit (IC); a substantially transparent protective cover coupled to the microdisplay IC; and a chip carrier defining an opening, wherein the microdisplay IC comprises; a semiconductor substrate; a pixel cell array fabricated within upper layers of semiconductor substrate, the pixel cell array including a plurality of pixel cells arranged in a two-dimensional grid; a plurality of pixel electrodes, each associated with a respective one of the plurality of pixel cells; a light switching layer in contact with the plurality of pixel electrodes; and an electrode disposed between the light switching layer and the substantially transparent protective cover; and wherein the cover extends over the plurality of pixel cells and partially into, fully into, partially through or fully through the opening defined by the chip carrier; and wherein the chip carrier comprises conductors to carry electrical signals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification