Photosensitive imaging devices and associated methods
DC CAFCFirst Claim
1. A photosensitive imager device, comprising:
- a semiconductor substrate having a substantially planar surface and multiple doped regions forming a least one junction;
a textured region coupled to the semiconductor substrate on a surface opposite the substantially planar surface and positioned to interact with electromagnetic radiation;
integrated circuitry formed at the substantially planar surface; and
an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction.
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Litigations
1 Petition
Accused Products
Abstract
Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor substrate having multiple doped regions forming at least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction. In one aspect, the textured region is operable to facilitate generation of an electrical signal from the detection of infrared electromagnetic radiation. In another aspect, interacting with electromagnetic radiation further includes increasing the semiconductor substrate'"'"'s effective absorption wavelength as compared to a semiconductor substrate lacking a textured region.
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Citations
26 Claims
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1. A photosensitive imager device, comprising:
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a semiconductor substrate having a substantially planar surface and multiple doped regions forming a least one junction; a textured region coupled to the semiconductor substrate on a surface opposite the substantially planar surface and positioned to interact with electromagnetic radiation; integrated circuitry formed at the substantially planar surface; and an electrical transfer element coupled to the semiconductor substrate and operable to transfer an electrical signal from the at least one junction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 24, 25, 26)
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13. A method of making a photosensitive imager device, comprising:
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forming a textured region on a semiconductor substrate, wherein the semiconductor substrate has a substantially planar surface opposite the textured region and multiple doped regions forming a least one junction, and wherein the textured region is formed in a position to interact with electromagnetic radiation; forming integrated circuitry on the substantially planar surface; and coupling an electrical transfer element to the semiconductor substrate such that the electrical transfer element is operable to transfer an electrical signal from the at least one junction. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A photosensitive imager device, comprising:
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a semiconductor substrate having a substantially planar surface and multiple doped regions forming a least one junction; a textured region coupled to the semiconductor substrate on a surface opposite the substantially planar surface and positioned to interact with electromagnetic radiation; and at least 4 transistors formed at the substantially planar surface with at least one of the transistors electrically coupled to the at least one junction.
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Specification