Split trench-gate MOSFET with integrated Schottky diode
First Claim
1. A semiconductor device, having a top surface and a bottom surface, the semiconductor device comprising:
- a semiconductor initial layer, having a first conductivity type;
a well region, formed in a portion of the initial layer, the well region having a second conductivity type, and the well region comprising at least two well region portions, and wherein a section of the initial layer between the well region portions extends to the top surface of the semiconductor device;
a trench gate structure, comprising a shield electrode and two gate electrodes, wherein a substantial portion of the shield electrode is directly beneath the two gate electrodes, and wherein a section of the shield electrode between the two gate electrodes extends to the top surface;
a source region, formed in the well region, the source region adjacent to the trench gate structure, and the source region having the first conductivity type; and
a source metal layer, contacting the initial layer, the well region, the shield electrode and the source region at the top surface, wherein a contact between the source metal layer and the initial layer at the top surface forms a Schottky diode.
1 Assignment
0 Petitions
Accused Products
Abstract
A split trench-gate MOSFET device and method for forming this device is disclosed. The device has a trench gate structure, comprising a shield electrode and two gate electrodes, wherein a substantial portion of shield electrode region is lower than the gate electrode region, and wherein a portion of the shield electrode region extends to the top surface between the two gate electrodes. The device further comprises a source metal layer, contacting to an initial layer, a well region, the shield electrode and a source region at the top surface, wherein the contact between the source metal layer and the initial layer forms a Schottky diode.
7 Citations
22 Claims
-
1. A semiconductor device, having a top surface and a bottom surface, the semiconductor device comprising:
-
a semiconductor initial layer, having a first conductivity type; a well region, formed in a portion of the initial layer, the well region having a second conductivity type, and the well region comprising at least two well region portions, and wherein a section of the initial layer between the well region portions extends to the top surface of the semiconductor device; a trench gate structure, comprising a shield electrode and two gate electrodes, wherein a substantial portion of the shield electrode is directly beneath the two gate electrodes, and wherein a section of the shield electrode between the two gate electrodes extends to the top surface; a source region, formed in the well region, the source region adjacent to the trench gate structure, and the source region having the first conductivity type; and a source metal layer, contacting the initial layer, the well region, the shield electrode and the source region at the top surface, wherein a contact between the source metal layer and the initial layer at the top surface forms a Schottky diode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A semiconductor device, having a top surface, comprising:
-
a split trench-gate metal-oxide semiconductor field effect transistor (MOSFET), comprising a drain region, a source region, a body region, a split trench-gate structure and a source metal layer, wherein the split trench gate structure having a shield electrode and two gate electrodes, wherein a substantial portion of the shield electrode is directly beneath the two gate electrodes, and wherein a section of the shield electrode between the two gate electrodes extends to the top surface of the device, and wherein the source metal layer contacts the source region, the body region and the shield electrode at the top surface; and a Schottky diode, formed next to the trench-gate MOSFET, wherein an anode of the Schottky diode is comprised by a portion of the source metal layer. - View Dependent Claims (11, 12, 13, 14)
-
-
15. A method of forming a semiconductor device, comprising:
-
forming a semiconductor initial layer, wherein the initial layer having a first conductivity type and having a top side and a bottom side, and wherein the top side serves as a top surface of the device, and the bottom side side serves as a bottom surface of the device; forming a well region comprising at least two well region portions in the semiconductor initial layer, wherein a portion of the semiconductor initial layer is between the well region portions at the top surface; forming a trench gate structure which stretches through the well region and into the semiconductor initial layer, wherein the trench gate structure has a shield electrode and two gate electrodes, wherein a substantial portion of the shield electrode is directly beneath the gate electrodes, and wherein the other portion of the shield electrode extends to the top surface of the device between the two gate electrodes; forming a source region in the well region proximate the trench gate structure; and forming a source metal layer contacting the initial layer, the well region, the source region and the shield electrode at the top surface wherein forming the contact between the source metal layer and the initial layer forms a Schottky diode. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
-
Specification