Electrical interconnect for die stacked in zig-zag configuration
First Claim
1. A semiconductor assembly comprising an elevated die mounted over and elevated above a support, said elevated die having a plurality of interconnect pads at a front side thereof, said support having pillars of a first electrically conductive material, each pillar on a respective bond pad at a mount side thereof, wherein the elevated die is electrically connected to the support by traces of a second electrically conductive material, each trace contacting each of at least two of said plurality of interconnect pads and the corresponding pillar on the corresponding bond pad, wherein said second electrically conductive material comprises a conductive material in particle form in a polymer matrix.
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Accused Products
Abstract
A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support. Die in the first tier are electrically interconnected die-to-die, and the tier is electrically connected to a support, by traces of an electrically conductive material contacting interconnect pads on the die and a first set of bond pads on the support. Pillars of a electrically conductive material are formed on a second set of bond pads, and die in the second tier are electrically interconnected die-to-die, and the tier is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the substrate.
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Citations
31 Claims
- 1. A semiconductor assembly comprising an elevated die mounted over and elevated above a support, said elevated die having a plurality of interconnect pads at a front side thereof, said support having pillars of a first electrically conductive material, each pillar on a respective bond pad at a mount side thereof, wherein the elevated die is electrically connected to the support by traces of a second electrically conductive material, each trace contacting each of at least two of said plurality of interconnect pads and the corresponding pillar on the corresponding bond pad, wherein said second electrically conductive material comprises a conductive material in particle form in a polymer matrix.
- 11. A semiconductor assembly comprising a plurality of die in a die stack mounted over a support, at least a first said die being elevated above the support, said first die having an interconnect pad at a front side thereof, said support having a pillar of a first electrically conductive material on a bond pad at a mount side thereof, wherein said first die is electrically connected to the support by a trace of a second electrically conductive material contacting the interconnect pad on the die to the pillar on the bond pad, wherein said second electrically conductive material comprises a conductive material in particle form in a polymer matrix, wherein at least a second said die is electrically connected to said first die by a trace of a third electrically conductive material contacting the interconnect pad on the first die with an interconnect pad on said second die.
- 22. A semiconductor assembly comprising a plurality of die in an upper die stack mounted over and elevated above a support, at least a first die in said upper stack having an interconnect pad at a front side thereof, said support having a pillar of a first electrically conductive material on a bond pad at a mount side thereof, wherein said first die in said upper stack is electrically connected to the support by a trace of a second electrically conductive material contacting the interconnect pad on said first die in said upper stack to the pillar on the bond pad, wherein said second electrically conductive material comprises a conductive material in particle form in a polymer matrix wherein at least a second said die in said upper stack is electrically connected to said first die by a trace of a third electrically conductive material contacting the interconnect pad on the first die with an interconnect pad on said second die.
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28. A die stack assembly comprising first and second tiered offset die stacks in a zig-zag configuration, a support having a first set of bond pads and a second set of bond pads, and a plurality of pillars projecting above and electrically connected with the second set of bond pads, wherein
die in the first die stack being electrically interconnected die-to-die by first traces of electrically conductive material contacting interconnect pads on die of the first die stack and the first traces of electrically conductive material electrically connect the die in the first die stack with the first set of bond pads; - and
die in the second die stack being electrically interconnected die-to-die by second traces of electrically conductive material contacting interconnect pads on die of the second die stack and the second traces of electrically conductive material electrically connect the die in the second die stack with the pillars, wherein the electrically conductive material comprises a conductive material in particle form in a polymer matrix. - View Dependent Claims (29, 30, 31)
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Specification