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Heat shield module for substrate-like metrology device

  • US 8,681,493 B2
  • Filed: 05/10/2011
  • Issued: 03/25/2014
  • Est. Priority Date: 05/10/2011
  • Status: Active Grant
First Claim
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1. A heat shield module, comprising:

  • a) a top portion made of a high heat capacity material;

    b) a bottom portion made of a high heat capacity material attached to the top portion, wherein an enclosure formed by the top portion and the bottom portion includes an opening sized to receive a component with no intervening insulating material between the component and the top and bottom portions, wherein the opening is slightly larger than the component;

    c) one or more legs mounted to either the top portion or the bottom portion, the legs being configured to attach the heat shield module to a substrate and to form a gap between a bottom surface of the bottom portion and a top surface of the substrate.

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