Heat shield module for substrate-like metrology device

• US 8,681,493 B2
• Filed: 05/10/2011
• Issued: 03/25/2014
• Est. Priority Date: 05/10/2011
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation (KLA Corporation)
• Original Assignee: KLA-Tencor Corporation (KLA Corporation)
• Inventors: Vishal, Vaibhaw, Sun, Mei
• Primary Examiner(s): Wagner, Jenny L
• Assistant Examiner(s): LOPEZ CRUZ, DIMARY S
• Application Number:
  US13/104,874
• Publication Number:
  US 20120287574A1
• Time in Patent Office: 1,050 Days
• Field of Search: 361/688, 361/679.46, 361/679.47, 361/719, 361/704, 361/717, 257/712, 257/717, 257/720, 428/223, 174/520, 174/50, 174/547, 174/548
• US Class Current: 361/688
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/249923 Including interlaminar mechanical fastener

Abstract

A heat shield module includes top and bottom portions made of a high heat material. The top and bottom portions attached to each other and form an enclosure with an opening sized to receive an electronic component package with no intervening insulating material between a component and the top and bottom portions. One or more legs are mounted to either the top portion or the bottom portion. The legs are configured to attach the enclosure to a substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.

Claims

1. A heat shield module, comprising:

a) a top portion made of a high heat capacity material;

b) a bottom portion made of a high heat capacity material attached to the top portion, wherein an enclosure formed by the top portion and the bottom portion includes an opening sized to receive a component with no intervening insulating material between the component and the top and bottom portions, wherein the opening is slightly larger than the component;

c) one or more legs mounted to either the top portion or the bottom portion, the legs being configured to attach the heat shield module to a substrate and to form a gap between a bottom surface of the bottom portion and a top surface of the substrate.

2. The heat shield module of claim 1, wherein the top portion and/or the bottom portion is made of stainless steel.

3. The heat shield module of claim 1, wherein an entire surface of the top portion and/or an entire surface of the bottom portion is polished to form a low emissivity surface.

4. The heat shield module of claim 1, wherein an entire surface of the top portion and/or an entire surface of the bottom portion is coated with a low emissivity material.

5. The heat shield module of claim 1, wherein the top portion and/or the bottom portion is composed of sapphire.

6. The heat shield module of claim 1, wherein the top portion and/or the bottom portion is composed of a nickel-cobalt ferrous alloy.

7. The heat shield module of claim 1, wherein the top portion and/or the bottom portion is composed of a nickel-steel alloy known generically as FeNi36.

8. The heat shield module of claim 1, wherein the one or more legs is composed of stainless steel.

9. The heat shield module of claim 1, wherein the one or more legs is composed of quartz.

10. The heat shield module of claim 1, wherein the one or more legs are configured such that the gap formed between the top surface of the substrate and the bottom surface of the bottom portion is at least 0.25 millimeters.

11. The heat shield module of claim 1, wherein top portion, bottom portion, and the one or more legs are configured such that a height of the heat shield module is between 2 millimeters and 10 millimeters above the top surface of the substrate when the heat shield module is mounted to the substrate.

12. The heat shield module of claim 1, wherein the enclosure is sized to receive a component having a thickness of 1 millimeter or less.

13. A component module, comprising:

a heat shield module including a top portion made of a high heat capacity material and a bottom portion made of a high heat capacity material with an enclosure formed by the top and bottom portions;

a component disposed in the enclosure, wherein the enclosure includes an opening sized to receive the component with no intervening insulating material between the component and the top and bottom portions, wherein the component is mounted to a surface of the enclosure with no intervening insulating material between the component and the surface of the enclosure; and

one or more legs attached to the heat shield module, the legs being configured to attach the enclosure to a substrate and to form a gap between a bottom surface of the bottom portion and a top surface of the substrate.

14. The component module of claim 13, wherein the component includes one or more batteries.

15. The component module of claim 13, wherein the component includes a central processing unit (CPU).

16. The component module of claim 13, wherein the component has a total thickness in the order of 1 millimeter or less.

17. The component module of claim 13, wherein the top portion and/or the bottom portion is made of stainless steel.

18. The component module of claim 13, wherein an entire surface of the top portion and/or an entire surface of the bottom portion is polished to form a low emissivity surface.

19. The component module of claim 13, wherein an entire surface of the top portion and/or an entire surface of the bottom portion is coated with a low emissivity material.

20. The component module of claim 13, wherein the top portion and/or the bottom portion is composed of sapphire.

21. The component module of claim 13, wherein the top portion and/or the bottom portion is composed of a nickel-cobalt ferrous alloy.

22. The component module of claim 13, wherein the top portion and/or the bottom portion is composed of a nickel-steel alloy known generically as FeNi36.

23. The component module of claim 13, wherein the one or more legs is composed of stainless steel.

24. The component module of claim 13, wherein the one or more legs is composed of quartz.

25. The component module of claim 13, wherein the one or more legs are configured such that the gap formed between the top surface of the substrate and the bottom surface of the bottom portion is at least 0.25 millimeters.

26. The component module of claim 13, wherein the top portion, the bottom portion, and the one or more legs are configured such that a height of the heat shield module is between 2 millimeters and 10 millimeters above the top surface of the substrate when the heat shield module is mounted to the substrate.

27. The component module of claim 13, wherein the opening is slightly larger than the component.

28. The component module of claim 13, wherein the component is secured to the surface of the enclosure by an adhesive.

29. A substrate-like metrology device, comprising:

a substrate; and

a heat shield module including a top portion made of a high heat capacity material and a bottom portion made of a high heat capacity material with an enclosure formed by the top and bottom portions, wherein the enclosure includes an opening sized to receive a component with no intervening insulating material between the component and the top and bottom portions, wherein the opening is slightly larger than the component; and

one or more legs attached to the heat shield module, the legs being configured to attach the enclosure to the substrate and to form a gap between the bottom surface of the bottom portion and a top surface of the substrate.

30. The device of claim 29, further comprising a component disposed in the enclosure, wherein the component is an electronic component package.

31. The device of claim 30, wherein the electronic component package is secured in the enclosure by an adhesive.

32. The device of claim 30, wherein the electronic component package is mounted to a surface of the enclosure with no intervening insulating material between the electronic component package and the surface of the enclosure.