Media device having a piezoelectric fan

• US 8,681,495 B2
• Filed: 03/29/2011
• Issued: 03/25/2014
• Est. Priority Date: 03/29/2011
• Status: Active Grant

• Current Assignee: Dish Technologies LLC (Echostar Corporation)
• Original Assignee: Eldon Technology Limited (Echostar Corporation)
• Inventors: Burton, David Robert, Stephens, Matthew, Blythe, Greg, Hardaker, Trevor
• Primary Examiner(s): SMITH, COURTNEY L
• Application Number:
  US13/074,964
• Publication Number:
  US 20120250256A1
• Time in Patent Office: 1,092 Days
• Field of Search: 36167946-67954, 361688-696, 361701-711, 361714-722, 361/752, 361760-761
• US Class Current: 361/695
• CPC Class Codes: H04N 21/426 Internal components of the client ; Characteristics thereof H04N5/44 takes precedence
• CPC Class Codes: H05K 7/20172 Fan mounting or fan specifications

Abstract

A media device includes at least one piezoelectric fan selectively located to draw or urge air past one or more electrical components, such as an integrated circuit chip. Preferably, the piezoelectric fan is located within a channel milled or otherwise formed in the chip, however the fan may be located proximate the channel yet in fluid communication therewith. The piezoelectric fan operates to convectively cool the electrical component and may also prevent heat that has been generated by the electrical component from moving toward another electrical component within the media device. Thus, the configuration and location of the piezoelectric fan may advantageously cool one component while preventing heat energy from building up around one or more other components mounted nearby.

Claims

1. A system comprising:

a chassis having at least one panel with opposing surfaces, and wherein one of the opposing surfaces is exposed to an ambient environment;

a circuit board located within the chassis;

an electrical component mounted on the circuit board, the electrical component having a channel formed therein, wherein components within the electrical component comprise;

at least one hot die that generates heat during operation; and

a piezoelectric fan arranged proximate the channel of the electrical component, and

wherein during operation, the piezoelectric fan generates a thermally convective flow of air that is drawn into the channel from outside of the electrical component,

wherein the convective flow of air is moved through the channel to the outside of the electrical component.

2. The system of claim 1, wherein the electric component is an integrated circuit chip.

3. The system of claim 1, wherein the at least one channel includes a top panel of the chassis.

4. The system of claim 1, wherein the channel is etched into the electric component.

5. The system of claim 1, wherein the channel is a duct extending through the electrical component.

6. The system of claim 1, wherein the piezoelectric fan is located within the channel.

7. The system of claim 1, wherein the piezoelectric fan is located adjacent to the channel.

8. The system of claim 1, wherein the piezoelectric fan is positioned to draw hot air generated by the electrical component in a desired direction.

9. The system of claim 8, wherein the desired direction is away from a second electrical component mounted on the circuit board.

10. The system of claim 8, wherein the piezoelectric fan is positioned to generate an air flow that moves beneath a heat shield.

11. A system comprising:

a chassis having a top panel with an interior surface and an exterior surface, wherein the exterior surface is exposed to an ambient environment;

a heat shield extending from the interior surface, the heat shield having an upper end portion coupled to the top panel and free end portion distal from the upper end portion;

a circuit board located within the chassis;

at least two electrical components mounted proximate each other on the circuit board, the electrical components spaced apart such that the free end portion of the heat shield is in the spaced apart region, one of the electrical components having a channel formed in the electrical component; and

a piezoelectric fan arranged in the chassis to generate air flow along the channel.

12. The system of claim 11, wherein the free end portion of the heat shield is spaced apart from the circuit board.

13. The system of claim 11, wherein one of the electrical components includes an integrated circuit chip with a hot die.

14. A method for cooling an electrical component within a media device, wherein internal components of the electrical component include at least one hot die and a piezoelectric fan, and wherein the electrical component includes a channel that permits a convective air flow to be drawn into the channel from outside of the electrical component and moved through the channel to the outside of the electrical component, the method comprising:

operating the hot die, wherein heat is generated during operation of the hot die; and

activating the piezoelectric fan to generate the convective air flow through the channel of the electrical component, wherein a rate of the air flow convectively transfers a desired amount of heat from the hot die of the electrical component to another region within the media device when the air flow is moved by operation of the piezoelectric fan to the outside of the electrical component.

15. The method of claim 14, wherein activating the piezoelectric fan includes selectively turning on the fan when a sensed temperature in the media device exceeds a set-point temperature.

16. The method of claim 14, wherein directing the air flow through the channel includes directing the air flow along an open channel.

17. The method of claim 14, wherein directing the air flow through the channel includes directing the air flow through a duct.

18. The method of claim 14, wherein convectively transferring heat includes drawing cooler air past the electrical component by action of the piezoelectric fan.

19. The method of claim 14, further comprising:

supporting the piezoelectric fan on a surface that defines one side of the channel.

20. The method of claim 14, wherein directing the air flow includes moving air beneath a free end of a heat shield proximate the electrical component.