Heat dissipation unit for a wireless network device

• US 8,681,501 B2
• Filed: 12/17/2010
• Issued: 03/25/2014
• Est. Priority Date: 12/17/2010
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Aruba Networks Incorporated (Hewlett-Packard Enterprise Company)
• Inventors: Govindasamy, Gururaj, Nguyen, Thomas, Lew, Hogan, Fraticelli, David
• Primary Examiner(s): SMITH, COURTNEY L
• Application Number:
  US12/971,962
• Publication Number:
  US 20120155015A1
• Time in Patent Office: 1,194 Days
• Field of Search: 36167946-67951, 361688-697, 361701-704, 361707-710, 361714-722, 361/752
• US Class Current: 361/710
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.

Claims

1. An apparatus comprising:

a heat dissipation unit comprising a first plurality of heat-radiating elements;

a casing encasing the heat dissipation unit, a plurality of holes in the casing being aligned with spaces between the plurality of heat radiating elements;

wherein the heat dissipation unit comprises a first section and a second section that is in physical contact with the first section,

wherein the first section including a first body and the first plurality of heat-radiating elements positioned around a periphery of the first body,

wherein the second section including (a) a second body having an aperture to provide access to a connector for electronics encased by the heat dissipation unit and (b) a second plurality of heat-radiating elements positioned around a periphery of the second body and aligned with the first plurality of heat-radiating elements.

2. The apparatus of claim 1 wherein the plurality of holes in the casing comprise a plurality of slots.

3. The apparatus of claim 1, wherein the casing comprises an upper cover and a lower cover, the upper cover includes the plurality of holes and the lower cover includes additional holes aligned with spaces between the second plurality of heat-radiating elements.

4. The apparatus of claim 1, wherein the heat dissipation unit is a heat sink.

5. The apparatus of claim 1, wherein the first body of the first section includes a plurality of recesses and the second body of the second section includes a plurality of recesses aligned with the plurality of recesses for the first section, wherein each of the plurality of recesses for the first body and each of the plurality of recesses for the second body includes an aperture adapted in size to receive a fastening element for securing the first section to the second section.

6. The apparatus of claim 1 wherein the upper cover includes a plurality of protrusions corresponding in size and location to the plurality of recesses of the first body for insertion therein, and the lower cover includes a plurality of protrusions corresponding in size and location to the plurality of recesses of the second body for insertion therein.

7. The apparatus of claim 1, further comprising heat generating electronics, wherein heat is transferred from the heat generating electronics to the heat dissipation unit via direct or indirect thermal contact.

9. The apparatus of claim 7 or 8, wherein the heat generating electronics comprise a circuit board and components attached to the circuit board.

10. The apparatus of claim 1, wherein a shape of the casing is substantially similar to the shape of the head dissipation unit.

11. The apparatus of claim 1, wherein the apparatus is a Wireless Access Point.

12. The apparatus of claim 1, wherein a first hole of the plurality of holes is different in shape than a second hole of the plurality of holes.

13. The apparatus of claim 1, wherein a first hole of the plurality of holes is different in size than a second hole of the plurality of holes.

14. The apparatus of claim 1, wherein the casing comprises an upper cover and a lower cover, wherein the plurality of holes comprises pairs of holes, wherein a first hole in each pair of holes is located on the upper cover and the second hole in that pair of holes is located directly opposite on the lower cover.

15. The apparatus of claim 1, wherein each of at least a subset of spaces between the first plurality of head-radiating elements is aligned with at least two holes of the one or more holes in the casing.

16. The apparatus of claim 1 further comprising (a) heat generating electronics and (b) a plurality of antennae positioned on a top surface of the first section of the heat dissipation unit, the top surface facing in a direction opposite from a bottom surface of the first section that faces the electronics.

8. An apparatus comprising;

a heat dissipation unit comprising a first plurality of heat-radiating elements;

a casing encasing the heat dissipation unit, a plurality of holes in the casing being aligned with spaces between the plurality of heat radiating elements;

heat generating electronics, wherein the heat dissipation unit encases the heat generating electronics.

17. The apparatus of claim 8 wherein the plurality of holes in the casing comprise a plurality of slots.

18. The apparatus of claim 8, wherein the heat dissipation unit is a heat sink.

19. The apparatus of claim 8, wherein a shape of the casing is substantially similar to the shape of the head dissipation unit.

20. The apparatus of claim 8, wherein the apparatus is a Wireless Access Point.

21. The apparatus of claim 8, wherein a first hole of the plurality of holes is different in shape than a second hole of the plurality of holes.

22. The apparatus of claim 8, wherein a first hole of the plurality of holes is different in size than a second hole of the plurality of holes.

23. The apparatus of claim 8, wherein the casing comprises an upper cover and a lower cover, wherein the plurality of holes comprises pairs of holes, wherein a first hole in each pair of holes is located on the upper cover and the second hole in that pair of holes is located directly opposite on the lower cover.

24. The apparatus of claim 8, wherein the heat dissipation unit encases the heat generating electronics on at least two sides of the heat generating electronics.

25. The apparatus of claim 8, wherein each of at least a subset of spaces between the first plurality of head-radiating elements is aligned with at least two holes of the one or more holes in the casing.

26. The apparatus of claim 8,

wherein the heat dissipation unit comprises a first section and a second section that is in physical contact with the first section,

wherein the first section including a first body and the first plurality of heat-radiating elements positioned around a periphery of the first body, and

wherein the second section including (a) a second body having an aperture to provide access to a connector for electronics encased by the heat dissipation unit and (b) a second plurality of heat-radiating elements positioned around a periphery of the second body and aligned with the first plurality of heat-radiating elements.