Method and device for packaging a substrate
First Claim
Patent Images
1. A display device, comprising:
- an electromechanical device disposed on a substrate and having a first opening, the electromechanical device including a first sacrificial layer and a movable layer disposed over at least a portion of the sacrificial layer;
a second sacrificial layer positioned over the electromechanical device and exposed to the first sacrificial layer through the first opening, wherein the first sacrificial layer and the second sacrificial layer are formed of different materials; and
a thin film backplane having a second opening, the thin film backplane positioned over the second sacrificial layer and sealing the electromechanical device within a package formed between the substrate and the thin film backplane.
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Abstract
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
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Citations
27 Claims
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1. A display device, comprising:
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an electromechanical device disposed on a substrate and having a first opening, the electromechanical device including a first sacrificial layer and a movable layer disposed over at least a portion of the sacrificial layer; a second sacrificial layer positioned over the electromechanical device and exposed to the first sacrificial layer through the first opening, wherein the first sacrificial layer and the second sacrificial layer are formed of different materials; and a thin film backplane having a second opening, the thin film backplane positioned over the second sacrificial layer and sealing the electromechanical device within a package formed between the substrate and the thin film backplane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a display device, comprising:
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providing an electromechanical device on a substrate, the electromechanical device having a first opening and including a first sacrificial layer and a movable layer disposed over at least a portion of the sacrificial layer; depositing a second sacrificial layer over the electromechanical device such that the second sacrificial layer is exposed to the first sacrificial layer through the first opening, the first sacrificial layer and the second sacrificial layer formed of different materials; and depositing a thin film backplane over the second sacrificial layer to seal the electromechanical device within a package formed between the substrate and the thin film backplane, the thin film backplane having a second opening. - View Dependent Claims (13, 14)
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15. A display device, comprising:
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an electromechanical device disposed on a substrate, the electromechanical device having a first opening and including a movable layer disposed over at least a portion of a first sacrificial layer; a second sacrificial layer positioned over the electromechanical device, the second sacrificial layer exposed to a portion of the first sacrificial layer through the first opening; a thin film backplane disposed over the second sacrificial layer such that a package structure is formed between the thin film backplane and the substrate; and a desiccant disposed within the package structure. - View Dependent Claims (16, 17, 18)
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19. A method of manufacturing a display, the method comprising:
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providing an electromechanical device on a substrate, the electromechanical device having a first opening and including a movable layer disposed over a first sacrificial layer; depositing a second sacrificial layer over the electromechanical device and the desiccant, the second sacrificial layer exposed to a portion of the first sacrificial layer through the first opening; depositing a thin film backplane over the second sacrificial layer such that a package structure is formed between the thin film backplane and the substrate, wherein a desiccant is contained within the package structure; and removing the first and the second sacrificial layers, wherein removing the second sacrificial layer provides a gap above the electromechanical device and below the thin film backplane, and wherein at least part of the desiccant is not removed with the first sacrificial layer and the second sacrificial layer. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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Specification