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High thermal conductivity materials aligned within resins

  • US 8,685,534 B2
  • Filed: 01/13/2012
  • Issued: 04/01/2014
  • Est. Priority Date: 06/15/2004
  • Status: Expired due to Fees
First Claim
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1. An impregnated electrical insulating tape comprising:

  • a backing layer;

    a mica paper layer bonded to the backing layer;

    a resin comprising high thermal conductivity fillers dispersed therein, the resin impregnated through the mica paper layer and the backing layer;

    wherein the high thermal conductivity fillers comprise surface functional groups that are disposed on or grafted to the high thermal conductivity fillers, the high thermal conductivity fillers forming covalent bonds between the fillers and the resin to form an intimate interface between the high thermal conductivity fillers and the resin.

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