High thermal conductivity materials aligned within resins
First Claim
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1. An impregnated electrical insulating tape comprising:
- a backing layer;
a mica paper layer bonded to the backing layer;
a resin comprising high thermal conductivity fillers dispersed therein, the resin impregnated through the mica paper layer and the backing layer;
wherein the high thermal conductivity fillers comprise surface functional groups that are disposed on or grafted to the high thermal conductivity fillers, the high thermal conductivity fillers forming covalent bonds between the fillers and the resin to form an intimate interface between the high thermal conductivity fillers and the resin.
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Abstract
In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types.
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Citations
20 Claims
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1. An impregnated electrical insulating tape comprising:
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a backing layer; a mica paper layer bonded to the backing layer; a resin comprising high thermal conductivity fillers dispersed therein, the resin impregnated through the mica paper layer and the backing layer; wherein the high thermal conductivity fillers comprise surface functional groups that are disposed on or grafted to the high thermal conductivity fillers, the high thermal conductivity fillers forming covalent bonds between the fillers and the resin to form an intimate interface between the high thermal conductivity fillers and the resin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An impregnated electrical insulating tape comprising:
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a backing layer; a mica paper layer bonded to the backing layer; a resin comprising high thermal conductivity fillers dispersed therein, the resin impregnated through the mica paper layer and the backing layer; wherein the high thermal conductivity fillers comprise surface functional groups that are disposed on or grafted to the high thermal conductivity fillers, the high conductivity fillers forming covalent bonds between the high conductivity fillers and the resin to form an intimate interface between the high thermal conductivity fillers and the resin; wherein the high thermal conductivity fillers and molecules of the resin are aligned in concert with one another in the same direction; and wherein at least 75% of the high thermal conductivity fillers are aligned within 15 degrees of a common direction. - View Dependent Claims (15, 16, 17)
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18. A method for electrically insulating an electrical object comprising:
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providing a mica tape comprising a mica paper layer bonded to a backing layer; winding the mica tape around the electrical object; impregnating the mica tape and the backing layer with a resin comprising high thermal conductivity fillers dispersed therein, wherein the high thermal conductivity fillers comprise surface functional groups that are disposed on or grafted to the high thermal conductivity fillers, the high conductivity fillers forming covalent bonds between the fillers and the resin to form an intimate interface between the high thermal conductivity fillers and the resin; aligning molecules of the resin and the high thermal conductivity fillers in concert with one another by an external force; and semi-curing or curing the resin to lock the alignment in position. - View Dependent Claims (19, 20)
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Specification