Solid element device and method for manufacturing the same

• US 8,685,766 B2
• Filed: 03/13/2012
• Issued: 04/01/2014
• Est. Priority Date: 03/10/2003
• Status: Active Grant

• Current Assignee: Sumita Optical Glass, Inc., Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Sumita Optical Glass, Inc., Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Suehiro, Yoshinobu, Inoue, Mitsuhiro, Kato, Hideaki, Hadame, Kunihiro, Tohmon, Ryoichi, Wada, Satoshi, Ota, Koichi, Aida, Kazuya, Watanabe, Hiroki, Yamamoto, Yoshinori, Ohtsuka, Masaaki, Sawanobori, Naruhito
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): TAYLOR, EARL N
• Application Number:
  US13/419,093
• Publication Number:
  US 20120171789A1
• Time in Patent Office: 749 Days
• Field of Search: 257/100, 257/E21.504, 257/E23.118, 257/E23.125, 257/E33.059, 438/26, 362/311.02, 362/311.05
• US Class Current: 438/26
• CPC Class Codes: C03B 23/20 Uniting glass pieces by fusing without substantial reshaping
• CPC Class Codes: C03C 27/06 Joining glass to glass by processes other than fusing fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66
• CPC Class Codes: C03C 8/24 Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2933/005 : relating to encapsulations
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Claims

1. A method of making a solid element device that comprises:

a solid element;

an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK; and

a glass sealing part covering the solid element for sealing the solid element, the method comprising;

forming the glass sealing part from a glass material at a temperature higher than a yield point of the glass material,

wherein said forming said glass sealing part comprises pressing the glass material at the temperature higher than the yield point of the glass material.

2. The method according to claim 1, wherein said glass material is pressed in a viscosity state of more than 10⁶ poise.

3. The method according to claim 1, wherein said glass material is pressed under high viscosity conditions in a range of 10⁸ poise to 10⁹ poise.

4. The method according to claim 1, wherein said glass material comprises a glass sheet.

5. The method according to claim 1, wherein said glass material comprises one selected from a SiO₂—

Nb₂O₅-based glass, a B₂O₃—

F-based glass, a P₂O₅—

F-based glass, a P₂O₅—

ZnO-based glass, a SiO₂—

B₂O₃—

La₂O₃-based glass, and a SiO₂—

B₂O₃-based glass.

6. The method according to claim 1, wherein said glass material comprises a SiO₂—

Nb₂O₅-based glass or a SiO₂—

B₂O₃-based glass.

7. The method according to claim 1, wherein said solid element comprises a light emitting diode (LED).

8. The method according to claim 1, wherein said element mount part comprises an inorganic material substrate on a side of which said solid element is mounted and to a backside of which an electrode is formed led out, a plurality of ones of the solid element being mounted on said inorganic material substrate and being sealed with said glass material.

9. The method according to claim 8, wherein said glass material comprises a preformed glass.

10. The method according to claim 1, wherein said pressing comprises a hot pressing.

11. The method according to claim 1, wherein said pressing is conducted such that the glass material is pressed onto an upper surface and a lower surface of the solid element by molds of a press.

12. The method according to claim 11, further comprising:

disposing a first sheet of the glass material on the solid element and a second sheet of the glass material under the solid element prior to said pressing.

13. The method according to claim 12, wherein said molds of the press comprise an upper mold and a lower mold, said pressing comprises:

placing the upper mold of the press to cover the first sheet; and

placing the lower mold of the press to cover the second sheet.

14. The method according to claim 13, wherein said pressing further comprises:

moving the upper mold and the lower mold of the press in a predetermined direction to apply pressure to the first sheet and the second sheet by said upper mold and the lower mold, respectively.

15. The method according to claim 1, wherein said glass sealing part comprises a side face formed by dicer cutting.

16. The method according to claim 1, wherein said element mount part comprises a heat dissipation pattern formed on a backside surface of said element mount part.

17. The method according to claim 16, wherein a plurality of ones of the solid element is mounted on said element mount part.

18. The method according to claim 1, wherein said glass sealing part directly contacts the solid element.