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Semiconductor devices with connection patterns

  • US 8,685,805 B2
  • Filed: 08/11/2011
  • Issued: 04/01/2014
  • Est. Priority Date: 08/06/2004
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a semiconductor device, the method comprising:

  • forming a stacked structure in which a sacrificial layer and an active layer are sequentially stacked on a semiconductor substrate;

    removing the sacrificial layer to form an empty space between the active layer and the semiconductor substrate;

    forming a first isolation dielectric pattern on the semiconductor substrate in the empty space;

    forming a semiconductor pattern on the semiconductor substrate, the semiconductor pattern filling the empty space and being separated from the semiconductor substrate; and

    forming a connection pattern that electrically connects the semiconductor pattern and the semiconductor substrate, wherein the connection pattern directly contacts a side surface of the semiconductor pattern and the semiconductor substrate at one side of the semiconductor pattern.

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