Semiconductor devices with connection patterns
First Claim
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1. A method for manufacturing a semiconductor device, the method comprising:
- forming a stacked structure in which a sacrificial layer and an active layer are sequentially stacked on a semiconductor substrate;
removing the sacrificial layer to form an empty space between the active layer and the semiconductor substrate;
forming a first isolation dielectric pattern on the semiconductor substrate in the empty space;
forming a semiconductor pattern on the semiconductor substrate, the semiconductor pattern filling the empty space and being separated from the semiconductor substrate; and
forming a connection pattern that electrically connects the semiconductor pattern and the semiconductor substrate, wherein the connection pattern directly contacts a side surface of the semiconductor pattern and the semiconductor substrate at one side of the semiconductor pattern.
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Abstract
Provided is a semiconductor device. The semiconductor device includes a semiconductor substrate, a first isolation dielectric pattern on the semiconductor substrate, and an active pattern on the first isolation dielectric pattern. A semiconductor pattern is interposed between the semiconductor substrate and the first isolation dielectric pattern, and a second isolation dielectric pattern is interposed between the semiconductor substrate and the semiconductor pattern. The semiconductor substrate and the semiconductor pattern are electrically connected by a connection pattern.
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Citations
20 Claims
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1. A method for manufacturing a semiconductor device, the method comprising:
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forming a stacked structure in which a sacrificial layer and an active layer are sequentially stacked on a semiconductor substrate; removing the sacrificial layer to form an empty space between the active layer and the semiconductor substrate; forming a first isolation dielectric pattern on the semiconductor substrate in the empty space; forming a semiconductor pattern on the semiconductor substrate, the semiconductor pattern filling the empty space and being separated from the semiconductor substrate; and forming a connection pattern that electrically connects the semiconductor pattern and the semiconductor substrate, wherein the connection pattern directly contacts a side surface of the semiconductor pattern and the semiconductor substrate at one side of the semiconductor pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a semiconductor device, the method comprising:
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forming a sacrificial pattern and an active pattern sequentially stacked on a semiconductor substrate; removing the sacrificial pattern to form an empty space between the active pattern and the semiconductor substrate; forming a first isolation dielectric layer covering a bottom surface of the active pattern; forming a second isolation dielectric layer separated from the first isolation dielectric layer on the semiconductor substrate; forming a semiconductor layer on the semiconductor substrate, the semiconductor layer filling the empty space and being separated from the semiconductor substrate by the second isolation dielectric layer; patterning the semiconductor layer and the second isolation dielectric layer to expose a portion of the semiconductor substrate; forming a connection layer on the exposed semiconductor substrate, the connection layer electrically connecting the semiconductor substrate to the semiconductor layer, and directly contacting the semiconductor layer; and etching upper portions of the patterned semiconductor layer and the connection layer to form a semiconductor pattern and a connection pattern. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification