Power electronics interconnection for electric motor drives
First Claim
1. A bus bar, comprising:
- a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor;
a first dielectric layer overlying a top surface of said first bus bar layer; and
a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer wherein;
said first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component;
said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer; and
a first portion of said first bus bar layer includes said second via and wherein said second bus bar layer does not overlay said first portion of said first bus bar layer.
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Accused Products
Abstract
The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.
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Citations
52 Claims
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1. A bus bar, comprising:
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a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of said first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer wherein; said first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component; said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer; and a first portion of said first bus bar layer includes said second via and wherein said second bus bar layer does not overlay said first portion of said first bus bar layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A bus bar, comprising:
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a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of said first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer wherein; said first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component; said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer; and said second bus bar layer includes a first plurality of electrically conductive mounting tabs formed from said second bus bar layer and extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer and wherein said first bus bar layer includes a second plurality of electrically conductive mounting tabs formed from said first bus bar layer and extending generally perpendicular to said first bus bar layer and through apertures in said dielectric layer and said second bus bar layer with said first and second plurality of mounting tabs extending about an equal distance from a top surface of said second bus bar layer. - View Dependent Claims (21, 22, 23)
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24. A bus bar, comprising:
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a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of said first bus bar layer; a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer; a second dielectric layer overlying said second bus bar layer; and a printed circuit board assembly (PCBA) overlying said second dielectric layer;
whereinsaid first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component; said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer; and said second dielectric layer and said PCBA each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said dielectric layers, through said second bus bar layer and into and through said PCBA. - View Dependent Claims (25, 26, 27)
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28. A bus bar, comprising:
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a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of said first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer, wherein said first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component; said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer; and said second bus bar layer includes a first plurality of electrically conductive mounting tabs extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer and wherein said first bus bar layer includes a second plurality of electrically conductive mounting tabs extending generally perpendicular to said first bus bar layer and through apertures in said dielectric layer and said second bus bar layer with said first and second plurality of mounting tabs extending about an equal distance from a top surface of said second bus bar layer. - View Dependent Claims (29, 30, 31, 32, 33, 34)
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35. A method, the method comprising the steps of:
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a) forming a first bus bar layer into a desired three-dimensional form factor, said first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; b) overlying a first dielectric layer over a top surface of said first bus bar layer; and c) forming a second bus bar layer conforming to said desired three-dimensional form factor, said second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer wherein; said first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component; said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer; and wherein a first portion of said first bus bar layer includes said second via and wherein said second bus bar layer does not overlay said first portion of said first bus bar layer. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
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Specification