System and methods for forming apertures in microfeature workpieces

• US 8,686,313 B2
• Filed: 09/17/2013
• Issued: 04/01/2014
• Est. Priority Date: 05/05/2004
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Watkins, Charles M., Hiatt, William M.
• Primary Examiner(s): Heinrich, Samuel M
• Application Number:
  US14/029,105
• Publication Number:
  US 20140014635A1
• Time in Patent Office: 196 Days
• Field of Search: 219/121.62, 219/121.71, 219/121.72, 298/30, 298/52, 216/18, 216/20, 216/94, 651/05, 438/106, 438/109
• US Class Current: 219/121.62
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 2103/56 semiconducting semiconducting devices B23K2101/40
• CPC Class Codes: B23K 26/03 Observing, e.g. monitoring, the workpiece
• CPC Class Codes: B23K 26/0342 Observing magnetic fields related to the workpiece
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/362 Laser etching
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/382 by boring
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H05K 2203/163 Monitoring a manufacturing process
• CPC Class Codes: H05K 3/0026 by laser ablation
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

Claims

1. A method for forming a plurality of apertures in a microfeature workpiece, the method comprising:

impinging a laser beam upon the microfeature workpiece to form a first aperture;

sensing the laser beam pass through the microfeature workpiece with a sensor; and

forming a second aperture by controlling the laser beam based on a determined number of pulses of the laser beam to form the first aperture and/or a determined elapsed time to form the first aperture.

2. The method of claim 1 wherein forming the second aperture comprises automatically determining the number of pulses of the laser beam and/or the elapsed time to form the first aperture.

3. The method of claim 1 wherein forming the second aperture comprises:

selecting an adjusted number of pulses by changing the determined number of pulses according to a correction factor; and

directing the laser beam toward the microfeature workpiece for the adjusted number of pulses to form the second aperture.

4. The method of claim 1 wherein forming the second aperture comprises:

selecting an adjusted time by changing the determined elapsed time according to a correction factor; and

directing the laser beam toward the microfeature workpiece for the adjusted time to form the second aperture.

5. The method of claim 1 wherein:

the second aperture comprises a blind hole; and

forming the second aperture comprises controlling the laser beam based on a selected depth of the blind hole.

6. The method of claim 1 wherein:

the microfeature workpiece includes a first surface and a second surface opposite the first surface; and

the method further comprises supporting the microfeature workpiece with a workpiece carrier so that a center region of the first surface and a center region of the second surface do not contact the workpiece carrier while directing the laser beam.