LED structure with enhanced mirror reflectivity

• US 8,686,429 B2
• Filed: 06/24/2011
• Issued: 04/01/2014
• Est. Priority Date: 06/24/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Bergmann, Michael, Donofrio, Matthew, Heikman, Sten, Schneider, Kevin S., Haberern, Kevin W., Edmond, John A.
• Primary Examiner(s): Maldonado, Julio J
• Assistant Examiner(s): BACHNER, ROBERT G
• Application Number:
  US13/168,689
• Publication Number:
  US 20120326159A1
• Time in Patent Office: 1,012 Days
• Field of Search: 257/76, 257/88, 257/E33.072, 257/79, 257/99, 438/22
• US Class Current: 257/76
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light-absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip comprises one or more LEDs, with each LED having an active region, a first contact under the active region having a highly reflective mirror, and a barrier layer adjacent the mirror. The barrier layer is smaller than the mirror such that it does not extend beyond the periphery of the mirror. In another possible embodiment, an insulator is further provided, with the insulator adjacent the barrier layer and adjacent portions of the mirror not contacted by the active region or by the barrier layer. In yet another embodiment, a second contact is provided on the active region. In a further embodiment, the barrier layer is smaller than the mirror such that the periphery of the mirror is at least 40% free of the barrier layer, and the second contact is below the first contact and accessible from the bottom of the chip.

Claims

1. An LED chip, comprising:

one or more LEDs, with each of said LEDs comprising;

an active region;

a first contact under said active region, said contact comprising a highly reflective mirror;

a barrier layer adjacent said mirror, said barrier layer smaller than said mirror such that it does not extend beyond the periphery of said mirror; and

an insulator adjacent said barrier layer, said active region, and at least one portion of said mirror not contacted by said barrier layer, said insulator comprising a first layer for preventing migration and a second layer having a low refractive index.

2. The LED chip of claim 1, wherein said active region is comprised of alternating p-GaN and n-GaN layers.

3. The LED chip of claim 1, wherein said active region is textured to enhance light extraction.

4. The LED chip of claim 1, wherein said first contact comprises a p-contact, and said mirror is Ag-based.

5. The LED chip of claim 1, wherein said barrier layer is comprised of a metal that is substantially less reflective than said mirror.

6. The LED chip of claim 1, further comprising an insulator adjacent said barrier layer, active region, and each portion of said mirror not contacted by said barrier layer.

7. The LED chip of claim 6, further comprising a reflective metal layer below and adjacent to said insulator layer.

8. The LED chip of claim 7, wherein said insulator and said reflective metal layer form a composite barrier that is significantly more reflective than said barrier layer, with the reflectivity of said composite barrier being >

80% or >

90%.

9. The LED chip of claim 7, wherein said reflective metal layer comprises Al or Ag.

10. The LED chip of claim 1, wherein said barrier layer is provided to prevent Ag migration of said mirror.

11. The LED chip of claim 1, wherein said barrier layer comprises a step or transition.

12. The LED chip of claim 6, wherein said insulator is provided to prevent Ag migration of said mirror and to have a low index of refraction.

13. The LED chip of claim 6, wherein said insulator is comprised of an oxide, nitride, or oxynitride of elements Si or Al.

14. The LED chip of claim 6, wherein said first and second layers are distinct.

15. The LED chip of claim 14, wherein said first layer is for preventing Ag migration and said second layer is thicker than said first layer.

16. The LED chip of claim 15, wherein said insulator is comprised of a third layer which is in contact with a reflective metal and is optimized for good adhesion to said reflective metal.

17. An LED chip, comprising:

one or more LEDs mounted on a submount, with each of said LEDs comprising;

an active region comprising a top semiconductor layer and a bottom semiconductor layer;

a first contact below said active region, said first contact comprising a highly reflective mirror;

a barrier layer adjacent said mirror, said barrier layer smaller than said mirror; and

an insulator adjacent said barrier layer and adjacent portions of said mirror not contacted by said active region or by said barrier layer

wherein at least part of one of said one or more barrier layers is a topside contact for said bottom semiconductor layer.

18. The LED chip of claim 17, wherein said first contact comprises a p-contact, and said mirror is Ag-based.

19. The LED chip of claim 17, wherein said barrier layer is comprised of a metal that is substantially less reflective than said mirror, said barrier layer further smaller than said mirror such that the periphery of said mirror is at least 40% free of said barrier layer.

20. The LED chip of claim 17, further comprising a reflective metal layer below and adjacent to said insulator layer, wherein said insulator and said reflective metal layer form a composite barrier that is significantly more reflective than said barrier layer, with the reflectivity of said composite barrier being >

80% or >

90%.

21. The LED chip of claim 17, wherein said barrier layer and said insulator are provided to prevent Ag migration of said mirror.

22. The LED chip of claim 21, wherein said insulator is further provided to have a low index of refraction.

23. The LED chip of claim 17, wherein said insulator is comprised of two or more distinct layers, with a first layer provided for preventing Ag migration, a second thicker layer having a low refractive index, and an optional third layer which is in contact with a reflective metal and is optimized for good adhesion to said reflective metal.

24. The LED chip of claim 17, further comprising a second contact comprising a n-contact, said n-contact comprised of Al.

25. The LED chip of claim 17, wherein the periphery of said chip is at least 40% free of said barrier layer.

26. The LED chip of claim 17, wherein said barrier layer comprises a step or transition.

27. An LED chip, comprising:

one or more LEDs, with each of said LEDs comprising;

an active region comprising a n-GaN and a p-GaN layer;

a first contact below said active region, said first contact comprising a highly reflective mirror;

a barrier layer adjacent said mirror, said barrier layer smaller than said mirror;

a second contact on said active region; and

a dielectric layer in contact with said mirror, said barrier layer, and a metal bond layer.

28. The LED chip of claim 27, wherein said second contact comprises an n-contact, said n-contact disposed on a roughened GaN layer.

29. The LED chip of claim 27, wherein the periphery of said mirror and the periphery of said chip is at least 40% free of said barrier layer.

30. The LED chip of claim 27, further comprising a passivation layer comprised of SiN for moisture resistance.