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Solid state lighting devices and methods

  • US 8,686,445 B1
  • Filed: 12/15/2010
  • Issued: 04/01/2014
  • Est. Priority Date: 06/05/2009
  • Status: Active Grant
First Claim
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1. A light emission package, the package comprising:

  • a leadframe comprising at least one electrical lead;

    a body structure encasing at least a portion of the leadframe;

    at least one light emitting diode (LED) with a bonding layer mounted to the light emission package at approximately a eutectic temperature of the bonding layer; and

    the body structure comprising a plastic material having a melting point within approximately 28°

    Celsius (C) or less of the eutectic temperature of the bonding layer.

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