Semiconductor device and method of manufacturing the same

• US 8,686,526 B2
• Filed: 11/19/2007
• Issued: 04/01/2014
• Est. Priority Date: 11/20/2006
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Kitagawa, Katsuhiko, Shinogi, Hiroyuki, Ishibe, Shinzo, Yamada, Hiroshi
• Primary Examiner(s): Lam, Cathy N
• Application Number:
  US11/942,506
• Publication Number:
  US 20080135967A1
• Time in Patent Office: 2,325 Days
• Field of Search: 257/434, 257/459, 257/466, 257/433, 257/E21.205, 257/E31.11
• US Class Current: 257/434
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0224 Electrodes
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

The invention is directed to providing a semiconductor device receiving a blue-violet laser, of which the reliability and yield are enhanced. A device element converting a blue-violet laser into an electric signal is formed on a front surface of a semiconductor substrate. An optically transparent substrate is attached to the front surface of the semiconductor substrate with an adhesive layer being interposed therebetween. The adhesive layer contains transparent silicone. Since the front surface of the device element is covered by the optically transparent substrate, foreign substances are prevented from adhering to the front surface of the device element. Furthermore, the adhesive layer is covered by the optically transparent substrate. This prevents the adhesive layer from being exposed to outside air, thereby preventing the degradation of the adhesive layer 6 due to a blue-violet laser.

Claims

1. A semiconductor device comprising:

a blue-violet laser emitting device emitting laser light having a wavelength between 400 and 415 nm;

a semiconductor substrate comprising a device element formed on a front surface thereof, the device element being configured to receive the laser light emitted from the blue-violet laser emitting device and to convert the received laser light into an electric signal;

a transparent substrate attached to the front surface of the semiconductor substrate so as to cover the device element; and

an adhesive layer comprising a transparent silicone and attaching the transparent substrate to the front surface of the semiconductor substrate, the adhesive layer covering the device element.

2. The semiconductor device of claim 1, wherein the adhesive layer comprises an epoxy silicone and an organosilane.

3. The semiconductor device of claim 1, further comprising a protection layer covering a side surface of the adhesive layer.

4. The semiconductor device of claim 3, further comprising a pad electrode electrically connected to the device element and a wiring layer electrically connected to the pad electrode and covering a side and a back surface of the semiconductor substrate, wherein the protection layer covers the side and the back surface of the semiconductor substrate and has an opening in a portion of the back surface, and a conductive terminal is disposed in the opening so as to be electrically connected to the wiring layer.

5. The semiconductor device of claim 3, further comprising a pad electrode electrically connected to the device element, wherein the protection layer covers a back surface of the semiconductor substrate and has an opening at the pad electrode, and a conductive terminal is disposed in the opening so as to be electrically connected to the pad electrode.

6. The semiconductor device of claim 3, further comprising a pad electrode electrically connected to the device element, wherein the protection layer covers a back surface of the semiconductor substrate and has an opening at the pad electrode, and a conductive terminal is disposed in the opening so as to be electrically connected to the pad electrode.

7. The semiconductor device of claim 3, wherein the transparent substrate comprises a slanting portion slanting from a surface of the transparent substrate attached to the front surface of the semiconductor substrate, and the protection layer covers the slanting portion.

8. The semiconductor device of claim 7, further comprising a pad electrode electrically connected to the device element and a wiring layer electrically connected to the pad electrode and covering a side and a back surface of the semiconductor substrate, wherein the protection layer covers the side and the back surface of the semiconductor substrate and has an opening in a portion of the back surface, and a conductive terminal is disposed in the opening so as to be electrically connected to the wiring layer.

9. The semiconductor device of claim 7, further comprising a pad electrode electrically connected to the device element, wherein the protection layer covers a back surface of the semiconductor substrate and has an opening at the pad electrode, and a conductive terminal is disposed in the opening so as to be electrically connected to the pad electrode.

10. The semiconductor device of claim 3, wherein the adhesive layer comprises an epoxy silicone and an organosilane.

11. The semiconductor device of claim 10, further comprising a pad electrode electrically connected to the device element and a wiring layer electrically connected to the pad electrode and covering a side and a back surface of the semiconductor substrate, wherein the protection layer covers the side and the back surface of the semiconductor substrate and has an opening in a portion of the back surface, and a conductive terminal is disposed in the opening so as to be electrically connected to the wiring layer.

12. The semiconductor device of claim 10, further comprising a pad electrode electrically connected to the device element, wherein the protection layer covers a back surface of the semiconductor substrate and has an opening at the pad electrode, and a conductive terminal is disposed in the opening so as to be electrically connected to the pad electrode.

13. The semiconductor device of claim 7, wherein the adhesive layer comprises an epoxy silicone and an organosilane.

14. The semiconductor device of claim 13, further comprising a pad electrode electrically connected to the device element and a wiring layer electrically connected to the pad electrode and covering a side and a back surface of the semiconductor substrate, wherein the protection layer covers the side and the back surface of the semiconductor substrate and has an opening in a portion of the back surface, and a conductive terminal is disposed in the opening so as to be electrically connected to the wiring layer.

15. The semiconductor device of claim 13, further comprising a pad electrode electrically connected to the device element, wherein the protection layer covers a back surface of the semiconductor substrate and has an opening at the pad electrode, and a conductive terminal is disposed in the opening so as to be electrically connected to the pad electrode.