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Semiconductor package substrates having layered circuit segments, and related methods

  • US 8,686,568 B2
  • Filed: 09/27/2012
  • Issued: 04/01/2014
  • Est. Priority Date: 09/27/2012
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a substrate, the substrate comprisinga core having a plurality of through holes and defining a first surface;

    a plurality of circuit segments disposed on the core, each of the circuit segments including a first patterned metal layer on the first surface, an intermediate metal layer on the first patterned metal layer, a barrier layer on the intermediate metal layer, and an upper metal pattern on the barrier layer; and

    a plurality of conductive pillars disposed in the through holes of the core and connected to the circuit segments, wherein an end of each conductive pillar protrudes from the first surface of the core such that an end surface of each conductive pillar is coplanar with a surface of a corresponding portion of the barrier layer, and wherein the upper metal pattern covers the end surfaces of the conductive pillars and the coplanar surface of the barrier layer.

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