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Transaction card assembly and methods of manufacture

  • US 8,690,064 B2
  • Filed: 04/30/2009
  • Issued: 04/08/2014
  • Est. Priority Date: 04/30/2009
  • Status: Expired due to Fees
First Claim
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1. A transaction card assembly constructed and arranged for use in a transaction by an issuee of the transaction card assembly, comprising:

  • a first layer including a sheet of material comprising a top surface, a bottom surface and a plurality of peripheral side surfaces, the entirety of at least one of the peripheral side surfaces for the first layer being externally exposed;

    a second layer including a sheet of material comprising a top surface, a bottom surface and a plurality of peripheral side surfaces, the entirety of at least one of the peripheral side surfaces for the second layer being externally exposed;

    a semiconductor device located at least partially between the first and second layers;

    an adhesive foam material between the first and second layers, the adhesive foam material expanding to fill a space between the first and second layers and to define, at least in part, a finished thickness for the transaction card assembly, the adhesive foam material at least partially encapsulating the semiconductor device and bonding the bottom surface of the first layer to the top surface of the second layer; and

    indicia attached to the first and second layers and the adhesive foam material that is interacted with in a transaction regarding the transaction card assembly.

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