Body waste collecting device

• US 8,690,849 B2
• Filed: 06/17/2008
• Issued: 04/08/2014
• Est. Priority Date: 06/21/2007
• Status: Active Grant

• Current Assignee: Coloplast A/S
• Original Assignee: Coloplast A/S
• Inventors: Bach, Anders, Stroebech, Esben, Lykke, Mads, Toftkaer, Astrid, Buus, Hasse, Kongebo, Tom
• Primary Examiner(s): Su, Susan
• Assistant Examiner(s): Townsend, Guy K
• Application Number:
  US12/452,226
• Publication Number:
  US 20100204664A1
• Time in Patent Office: 2,121 Days
• Field of Search: 604/344
• US Class Current: 604/344
• CPC Class Codes: A61F 5/443 having adhesive seals for securing to the body, e.g. of hydrocolloid type, e.g. gels, starches, karaya gums adhesives or sealing pads therefor A61L24/00
• CPC Class Codes: A61F 5/445 Colostomy, ileostomy or urethrostomy devices A61F5/441, A61F5/442, A61F5/443 take precedence

Abstract

A body waste collecting device for attachment to the body comprising a collecting pouch comprising a first wall and a second wall, the pouch being attached to an adhesive wafer, wherein a central portion of the wafer constitutes a part of the first wall of the pouch, the wafer comprises a permeable backing layer, at least one layer of an absorbent adhesive layer wherein the wafer comprises a moisture impermeable layer at least in the central portion.

Claims

1. A body waste collecting device for attachment to the body comprising

a) a collecting pouch having a first wall and a second wall and

b) an adhesive wafer having a central portion that is part of the first wall of the pouch, the adhesive wafer comprising

a permeable backing layer having a MVTR higher than 100 g/m²/24 h,

at least one adhesive layer, the adhesive layer being soft, absorbent, and moisture permeable, and

a moisture impermeable layer at least in the central portion of the wafer and located either between the adhesive layer and the backing layer or on top of the backing layer,

wherein moisture is prevented from passing from the pouch to the adhesive layer.

2. The device according to claim 1, wherein the backing layer is soft with high tensile strength.

3. The device according to claim 1, wherein the backing layer has a low-modulus and is in the form of a polymer film, coating, laminate, textile, or non-woven.

4. The device according to claim 1, wherein the backing layer has a low-modulus and a force below 0.75 N/4 mm at 20% extension.

5. The device according to claim 1, wherein the backing layer has a low-modulus and a force below 0.5 N/4 mm at 20% extension.

6. The device according to claim 1, wherein the adhesive layer comprises a silicone, polyurethane, or polyacrylate based adhesive.

7. The device according to claim 1, wherein the adhesive layer comprises a polyalkyleneoxide polymer and an organosiloxane based cross-linked adhesive system.

8. The device according to claim 1, wherein the adhesive layer comprises ethylene vinyl acetate.

9. The device according to claim 1, wherein the peripheral portion of the wafer is outside the pouch.

10. The device according to claim 1, wherein the moisture impermeable layer extends to the peripheral portion of the wafer.

11. The device according to claim 1, wherein the moisture impermeable layer has a MVTR lower than 20 g/m²/24 h.

12. The device according to claim 1, wherein the moisture impermeable layer is in the form of a film.

13. The device according to claim 1, wherein the moisture impermeable layer is in the form of a thermoplastic film.

14. The device according to claim 1, wherein the moisture impermeable layer is in the form of a coating.

15. The device according to claim 1, wherein the moisture impermeable layer is an adhesive layer.

16. The device according to claim 1, wherein the wafer comprises a layer of non-absorbent adhesive.

17. The device according to claim 1, wherein the collecting device is an ostomy appliance.

18. The device according to claim 1, wherein the collecting device is a faecal collecting device.

19. The device according to claim 1, wherein the collecting device is a fistula collecting device.

20. The device according to claim 1, wherein the moisture impermeable layer is only in the central portion of the wafer.