Substrate lamination system and method

• US 8,691,043 B2
• Filed: 01/18/2008
• Issued: 04/08/2014
• Est. Priority Date: 08/30/2005
• Status: Active Grant

• Current Assignee: Rockwell Collins, Inc. (Rtx Corporation)
• Original Assignee: Rockwell Collins, Inc. (Rtx Corporation)
• Inventors: Sampica, James D., Nemeth, Paul R., Barnidge, Tracy J., Marzen, Vincent P.
• Primary Examiner(s): AFTERGUT, JEFFRY H
• Application Number:
  US12/009,375
• Publication Number:
  US 20090120572A1
• Time in Patent Office: 2,272 Days
• Field of Search: 156/285, 156/286, 156/104, 156/106, 156/382
• US Class Current: 156/286
• CPC Class Codes: B32B 2038/1891 Using a robot for handling the layers
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/04 Time
• CPC Class Codes: B32B 2309/72 For measuring or regulating, e.g. systems with feedback loops
• CPC Class Codes: B32B 2315/08 Glass
• CPC Class Codes: B32B 2457/202 LCD, i.e. liquid crystal displays
• CPC Class Codes: B32B 37/003 to avoid air inclusion
• CPC Class Codes: B32B 37/0046 characterised by constructional aspects of the apparatus
• CPC Class Codes: B32B 37/1018 using only vacuum
• CPC Class Codes: B32B 37/12 characterised by using adhesives

Abstract

The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive later between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate. A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first and second substrates.

Claims

1. A process for laminating substrates, the process comprising the steps:

disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first rigid substrate and a substantially planar surface of a second rigid substrate;

disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber;

disposing a mask member within the vacuum chamber with the first and second substrates over at least a portion of one of the first substrate and the second substrate to prevent contact between the portion and a flexible member;

evacuating the vacuum chamber;

applying pressure to at least one of the first substrate and the second substrate by expanding the flexible member;

wherein the first substrate comprises a display monitor.

2. The process of claim 1, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first rigid substrate and a substantially planar surface of a second rigid substrate further comprises:

disposing a sheet of pressure-sensitive adhesive between a substantially planar surface of the first substrate and a substantially planar surface of the second substrate.

3. The process of claim 1, wherein the disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate further comprises:

coating at least one of the substantially planar surface of the first substrate or the substantially planar surface of the second substrate with a pressure-sensitive adhesive.

4. The process of claim 1, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

co-aligning a portion of the first substrate with a portion of the second substrate.

5. The process of claim 1, wherein the disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber further comprises:

maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer.

6. The process of claim 5, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on a support pin.

7. The process of claim 6, wherein the supporting at least one of the first substrate and the second substrate on a support pin further comprises:

supporting the at least one of the first substrate and the second substrate on a retractable support pin.

8. The process of claim 5, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on a deformable support.

9. The process of claim 5, wherein the maintaining at least a portion of at least one of the first substrate and second substrate in spatial separation from the pressure-sensitive adhesive layer further comprises:

supporting at least one of the first substrate and the second substrate on an electromagnetic support.

10. The process of claim 1, wherein the evacuating the vacuum chamber further comprises:

evacuating a first portion of the vacuum chamber to a first pressure.

11. The process of claim 10, wherein the evacuating the vacuum chamber further comprises:

evacuating a second portion of the vacuum chamber to a second pressure.

12. The process of claim 1, wherein the applying pressure to at least one of the first substrate and the second substrate further comprises:

expanding the flexible member by the application of pressure to a surface of the flexible membrane.

13. The process of claim 12, wherein the expanding the flexible member by the application of pressure to a surface of the flexible membrane further comprises:

expanding the flexible member by the application of air pressure to a surface of the flexible membrane.

14. The process of claim 1, further comprising:

contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer.

15. The process of claim 14, wherein the contacting at least one of the substantially planar surface of the first substrate and the substantially planar surface of the second substrate to the pressure-sensitive adhesive layer further comprises:

retracting a support pin.

16. The process of claim 1, further comprising:

heating at least one of the first substrate, pressure-sensitive adhesive layer, and second substrate.

17. The process of claim 16, further comprising:

pressurizing an environment containing the first substrate, pressure-sensitive adhesive layer, and second substrate.

18. The process of claim 1, further comprising:

inserting an alignment insert into the vacuum chamber, the alignment insert configured to align the first substrate with the second substrate; and

supporting at least one of the first and second substrates with a support pin disposed in a vacuum chamber body, the vacuum chamber body forming at least part of the vacuum chamber; and

wherein the alignment insert is removable from the vacuum chamber body and the support pin after applying pressure to at least one of the first substrate and the second substrate.

19. The process of claim 1, wherein applying a pressure to at least one of the first substrate and the second substrate by expanding the flexible member includes directing pressurized air through a diffuser screen to provide uniform airflow distribution within the vacuum chamber.

20. The process of claim 1, wherein the mask member defines a mask aperture.

21. The process of claim 20, wherein the mask member is supported on a substrate alignment guide.

22. A process comprising:

disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first rigid substrate and a substantially planar surface of a second rigid substrate, the first substrate comprising a display monitor;

disposing the first substrate, pressure-sensitive adhesive layer and second substrate within an alignment insert, the alignment insert provided within a vacuum chamber body at least partially defining a vacuum chamber;

disposing a mask member over at least a portion of one of the first substrate and the second substrate, the mask member configured to prevent contact between the portion and a flexible member;

supporting at least one of the first and second substrates within the vacuum chamber with a support pin disposed in the vacuum chamber body;

evacuating the vacuum chamber;

applying pressure to at least one of the first substrate and the second substrate;

wherein the alignment insert is removable from the vacuum chamber body and the support pin.

23. The process of claim 22, wherein applying pressure to at least one of the first substrate and the second substrate comprises applying pressure to the first substrate via a first flexible membrane and applying pressure to the second substrate via a second flexible membrane.

24. The process of claim 23, further comprising supporting the first and second substrates in a vertical orientation as pressure is applied by the first and second flexible membranes.

25. The process of claim 22, wherein the alignment insert comprises a generally planar member.

26. The process of claim 22, further comprising retracting the support pin using a computer control unit prior to applying pressure to at least one of the first substrate and the second substrate;

and

removing the alignment insert after applying pressure to at least one of the first substrate and the second substrate.