Method for producing bonded wafer

• US 8,691,665 B2
• Filed: 11/18/2010
• Issued: 04/08/2014
• Est. Priority Date: 01/12/2010
• Status: Active Grant

• Current Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Original Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Inventors: Oka, Satoshi, Aga, Hiroji, Kato, Masahiro, Noto, Nobuhiko
• Primary Examiner(s): Geyer, Scott B
• Assistant Examiner(s): Seven, Evren
• Application Number:
  US13/514,414
• Publication Number:
  US 20120244679A1
• Time in Patent Office: 1,237 Days
• Field of Search: 438584-588
• US Class Current: 438/459
• CPC Class Codes: H01L 21/302 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/3247 for altering the shape, e.g. smoothing the surface
• CPC Class Codes: H01L 21/76254 with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond

Abstract

The present invention is directed to a method for producing a bonded wafer, the method in which heat treatment for flattening the surface of a thin film is performed on a bonded wafer made by the ion implantation delamination method in an atmosphere containing hydrogen or hydrogen chloride, wherein the surface of a susceptor on which the bonded wafer is to be placed, the susceptor used at the time of flattening heat treatment, is coated with a silicon film in advance. As a result, a method for producing a bonded wafer is provided, the method by which a bonded wafer having a thin film with good film thickness uniformity can be obtained even when heat treatment for flattening the surface of a thin film of a bonded wafer after delamination is performed in the ion implantation delamination method.

Claims

1. A method for producing a bonded wafer, the method in which an ion implanted layer is formed by implanting a gas ion of at least one of a hydrogen ion and a rare gas ion from a surface of a bond wafer, a bonded wafer having a thin film on a base wafer is made by bonding the ion implanted surface of the bond wafer and a surface of a base wafer directly or through an oxide film and then delaminating the bond wafer at the ion implanted layer, and heat treatment for flattening the surface of the thin film is then performed on the bonded wafer in an atmosphere containing hydrogen or hydrogen chloride,

wherein

the surface of a susceptor on which the bonded wafer is to be placed, the susceptor used at the time of the flattening heat treatment, is coated with a silicon film in advance, and

in the surface of a bonded wafer-placing surface side of the susceptor, the silicon film with which the susceptor is coated coats a surface other than a region in which a back surface of the bonded wafer is to make contact with the susceptor.

2. The method for producing a bonded wafer according to claim 1, wherein

as the bond wafer and the base wafer, silicon single crystal wafers are used.

3. The method for producing a bonded wafer according to claim 1, wherein

the surface of the susceptor other than a region in which the back surface of the bonded wafer and the susceptor are to make contact with each other is coated with the silicon film by placing a dummy wafer on the susceptor, coating the surface of the susceptor with the silicon film, and then removing the dummy wafer.

4. The method for producing a bonded wafer according to claim 2, wherein

the surface of the susceptor other than a region in which the back surface of the bonded wafer and the susceptor are to make contact with each other is coated with the silicon film by placing a dummy wafer on the susceptor, coating the surface of the susceptor with the silicon film, and then removing the dummy wafer.

5. The method for producing a bonded wafer according to claim 1, wherein

an epitaxial layer is grown on the thin film of the bonded wafer on which the flattening heat treatment was performed.

6. The method for producing a bonded wafer according to claim 2, wherein

an epitaxial layer is grown on the thin film of the bonded wafer on which the flattening heat treatment was performed.

7. The method for producing a bonded wafer according to claim 3, wherein

an epitaxial layer is grown on the thin film of the bonded wafer on which the flattening heat treatment was performed.

8. The method for producing a bonded wafer according to claim 4, wherein

an epitaxial layer is grown on the thin film of the bonded wafer on which the flattening heat treatment was performed.