Device for analysis of a sample on a test element
First Claim
1. An analysis device for analysis of a sample on a test element, comprising at least one first component configured to make electrical contact with at least one second component for electrical transmission therebetween, wherein the first component comprises an injection-molded circuit mount, wherein the first component has at least one sprung contact lug, configured to make contact with the second component, which sprung contact lug comprises a contact lug body comprising an injection-molded plastic and a metallic electrical conductor structure, wherein the contact lug is configured to make electrical contact with a rotating second component of the analysis device.
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Accused Products
Abstract
An analysis device for analysis of a sample on a test element is provided that comprises at least one component configured to make electrical contact with at least one other component for electrical transmission therebetween. The at least one component generally comprises an injection-molded circuit mount, also called an MID, or molded interconnect device.
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Citations
13 Claims
- 1. An analysis device for analysis of a sample on a test element, comprising at least one first component configured to make electrical contact with at least one second component for electrical transmission therebetween, wherein the first component comprises an injection-molded circuit mount, wherein the first component has at least one sprung contact lug, configured to make contact with the second component, which sprung contact lug comprises a contact lug body comprising an injection-molded plastic and a metallic electrical conductor structure, wherein the contact lug is configured to make electrical contact with a rotating second component of the analysis device.
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7. A method for producing an analysis device for analysis of a sample on a test element, comprising:
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producing at least one first component configured to make electrical contact with at least one second component for electrical transmission therebetween, the first component comprising a base body and a metallic conductor structure, said producing being performed according to a method for producing injection-molded circuit mounts, wherein the first component has at least one sprung contact lug, configured to make contact with the second component, which spring contact lug comprises a contact lug body comprising an injection-molded plastic and a metallic electrical conductor structure, wherein the contact lug is configured to make electrical contact with a rotating second component of the analysis device; and positioning and mounting the first component in the analysis device. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification