Light emitting diode package structure

• US 8,692,274 B2
• Filed: 04/17/2012
• Issued: 04/08/2014
• Est. Priority Date: 02/24/2009
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Li, Chao-Wei, Hsu, Chen-Peng, Tsai, Yao-Jun, Hu, Hung-Lieh
• Primary Examiner(s): Tran, Thien F
• Application Number:
  US13/448,413
• Publication Number:
  US 20120199862A1
• Time in Patent Office: 721 Days
• Field of Search: None
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.

Claims

1. A LED package structure, comprising:

a carrier substrate;

at least one LED chip, disposed over the carrier substrate;

an optical element, disposed on the carrier substrate and forming a sealed space with the carrier substrate, wherein the at least one LED chip is disposed in the sealed space;

a thermal-conductive transparent liquid, filling up the sealed space;

a conformal insulation layer covering the at least one LED chip and isolating the at least one LED chip from the thermal-conductive transparent liquid;

a fixed component disposed directly on the carrier substrate; and

a sealing member disposed outside the sealed space and on the fixed component, wherein the sealing member, without directly contacting with the carrier substrate, connects the carrier substrate and an outer periphery of the optical element through the fixed component in-between, and wherein the at least one LED chip sequentially from bottom to top comprises;

a first semiconductor layer, fixed to the carrier substrate through a first bonding layer;

an active layer, disposed on the first semiconductor layer;

a first electrode layer, extending from a top surface of the first semiconductor layer to the carrier substrate, wherein the first electrode layer is separate from the active layer;

a second semiconductor layer, disposed on the active layer; and

a second electrode layer, extending from a top surface of the second semiconductor layer to the carrier substrate and covering a side surface of the at least one LED chip.

2. The LED package structure of claim 1, wherein the at least one LED chip further comprises a first insulating layer located between the second electrode layer and the side surface of the at least one LED chip.