Systems and methods for making and using electrical stimulation systems with improved RF compatibility
First Claim
1. An implantable control module for an electrical stimulation system, the control module comprising:
- an electronic subassembly disposed in a sealed housing, the electronic subassembly comprising a pulse generator, wherein at least a portion of the housing is formed from a conductive material;
a connector configured and arranged for receiving a lead or lead extension, the connector disposed outside the sealed housing, wherein the connector comprises a plurality of connector contacts;
a plurality of feedthrough pins extending through the sealed housing, each of the plurality of feedthrough pins being electrically coupled to a different one of the connector contacts;
a plurality of conductive pathways disposed in the housing, each of the plurality of conductive pathways electrically coupling a different one of the plurality of feedthrough pins to the electronic subassembly;
a ground line electrically coupling the electronic subassembly to a ground pin that, in turn, is electrically coupled to a conductive portion of the housing; and
a capacitive flex circuit disposed in the housing, the capacitive flex circuit comprising a multi-layered flexible substrate comprising a top layer, a bottom layer, and a dielectric layer disposed between the top layer and the bottom layer, wherein the top layer comprises a plurality of first conductive traces electrically coupling the plurality of feedthrough pins to the plurality of conductive pathways, and wherein the bottom layer comprises a plurality of second conductive traces electrically coupling the plurality of first conductive traces to the ground pin.
1 Assignment
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Accused Products
Abstract
An implantable control module for an electrical stimulation system includes an electronic subassembly disposed in a sealed conductive housing. A plurality of feedthrough pins extend through the sealed housing and couple connector contact of an external connector to the electronic subassembly. Each of the plurality of conductive pathways electrically couples a different one of the plurality of feedthrough pins to the electronic subassembly. A ground line electrically couples the electronic subassembly to the housing. A capacitive flex circuit is disposed in the housing and couples to each of the feed through pins. For each of the plurality of feedthrough pins the capacitive flex circuit includes a first conductive path electrically coupling the feedthrough pin to a corresponding conductive pathway of the plurality of conductive pathways, and a second conductive path electrically coupling the feedthrough pin to the ground pin.
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Citations
20 Claims
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1. An implantable control module for an electrical stimulation system, the control module comprising:
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an electronic subassembly disposed in a sealed housing, the electronic subassembly comprising a pulse generator, wherein at least a portion of the housing is formed from a conductive material; a connector configured and arranged for receiving a lead or lead extension, the connector disposed outside the sealed housing, wherein the connector comprises a plurality of connector contacts; a plurality of feedthrough pins extending through the sealed housing, each of the plurality of feedthrough pins being electrically coupled to a different one of the connector contacts; a plurality of conductive pathways disposed in the housing, each of the plurality of conductive pathways electrically coupling a different one of the plurality of feedthrough pins to the electronic subassembly; a ground line electrically coupling the electronic subassembly to a ground pin that, in turn, is electrically coupled to a conductive portion of the housing; and a capacitive flex circuit disposed in the housing, the capacitive flex circuit comprising a multi-layered flexible substrate comprising a top layer, a bottom layer, and a dielectric layer disposed between the top layer and the bottom layer, wherein the top layer comprises a plurality of first conductive traces electrically coupling the plurality of feedthrough pins to the plurality of conductive pathways, and wherein the bottom layer comprises a plurality of second conductive traces electrically coupling the plurality of first conductive traces to the ground pin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification