Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
First Claim
1. A computer-implemented method for polishing substrates, the method comprising:
- receiving, by a computing system including a processor, data relating to material removal rates for a plurality of substantially annular regions on a current wafer;
predicting, by the computing system, a material removal rate for each of the plurality of substantially annular regions using a wafer polishing model that is based on measurement of one or more previous wafers that have completed at least one step of a polishing process, wherein the wafer polishing model defines an effect of a tool state of the at least one polishing station on polishing effectiveness based on applying a scaling factor that depends on pad life and disk life;
calculating, by the computing system, a difference between the predicted material removal rates and actual material removal rates that are determined based on the received data;
updating, by the computer system, the wafer polishing model based on the calculated difference; and
adjusting, by the computing system, a processing parameter of the polishing process based on the updated wafer polishing model.
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Abstract
A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.
394 Citations
20 Claims
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1. A computer-implemented method for polishing substrates, the method comprising:
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receiving, by a computing system including a processor, data relating to material removal rates for a plurality of substantially annular regions on a current wafer; predicting, by the computing system, a material removal rate for each of the plurality of substantially annular regions using a wafer polishing model that is based on measurement of one or more previous wafers that have completed at least one step of a polishing process, wherein the wafer polishing model defines an effect of a tool state of the at least one polishing station on polishing effectiveness based on applying a scaling factor that depends on pad life and disk life; calculating, by the computing system, a difference between the predicted material removal rates and actual material removal rates that are determined based on the received data; updating, by the computer system, the wafer polishing model based on the calculated difference; and adjusting, by the computing system, a processing parameter of the polishing process based on the updated wafer polishing model. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A non-transitory computer-readable memory medium embodied with executable code that cause a processor to perform operations comprising:
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receiving data relating to material removal rates for a plurality of substantially annular regions on a current wafer; predicting a material removal rate for each of the plurality of substantially annular regions using a wafer polishing model that is based on measurement of one or more previous wafers that have completed at least one step of a polishing process, wherein the wafer polishing model defines an effect of a tool state of the at least one polishing station on polishing effectiveness based on applying a scaling factor that depends on pad life and disk life; calculating a difference between the predicted material removal rates and actual material removal rates that are determined based on the received data; updating the wafer polishing model based on the calculated difference; and adjusting a processing parameter of the polishing process based on the updated wafer polishing model. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification