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Built-in self-test methods, circuits and apparatus for concurrent test of RF modules with a dynamically configurable test structure

  • US 8,694,276 B2
  • Filed: 03/08/2011
  • Issued: 04/08/2014
  • Est. Priority Date: 01/20/2011
  • Status: Active Grant
First Claim
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1. A testable integrated circuit chip comprising:

  • a functional circuit having modules;

    a storage circuit operable to hold a table representing sets of compatible tests that are compatible for concurrence; and

    an on-chip test controller coupled with said storage circuit and with said functional circuit modules, said test controller operable to dynamically schedule and trigger the tests in those sets, whereby promoting concurrent execution of tests in said functional circuit modules.

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