Micro-electromechanical system device having electrical insulating structure and manufacturing methods

• US 8,695,426 B2
• Filed: 08/29/2011
• Issued: 04/15/2014
• Est. Priority Date: 12/23/2010
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Hsu, Yu Wen, Huang, Chao Ta, Lin, Shih Ting, Chen, Jen Yi
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US13/220,068
• Publication Number:
  US 20120160027A1
• Time in Patent Office: 960 Days
• Field of Search: 735/041.2, 735/041.4, 735/040.2, 735/040.4, 735/040.8, 735/143.2, 735/143.8
• US Class Current: 73/504.12
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: G01C 19/5762 the sensing mass being connected to a driving mass, e.g. driving frames

Abstract

The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

Claims

1. A micro-electromechanical system (MEMS) device, comprising:

at least one moving part;

at least one anchor having a first conductive pillar;

at least one spring connected to the at least one anchor and to the at least one moving part; and

an insulating layer disposed in the at least one moving part and the at least one anchor, wherein each of the at least one moving part is divided into a first conductive portion and a second conductive portion by the insulating layer, the at least one anchor is divided into a first conductive portion and a second conductive portion by the insulating layer, the first conductive pillar connects the first conductive portion and the second conductive portion respectively.

2. The MEMS device of claim 1, the at least one anchor comprises an insulating portion and at least one conductive pillar, the insulating portion is disposed in either the first conductive portion of the at least one anchor or the second conductive portion of the at least one anchor such that either the first conductive portion of the at least one anchor or the second conductive portion of the at least one anchor is divided into an outer conductive portion of the at least one anchor and an inner conductive portion of the at least one anchor by the insulating portion, the at least one conductive pillar is connected to the outer conductive portion of the at least one anchor and to either the first conductive portion of the at least one anchor or the second conductive portion of the at least one anchor which is not divided by the insulating portion.

3. The MEMS device of claim 1, wherein the insulating layer is further disposed in the at least one spring, and the at least one spring is divided into a first conductive portion and a second conductive portion by the insulating layer.

4. The MEMS device of claim 1, the at least one moving part further comprises at least one conductive pillar which connected to the first conductive portion of the at least one moving part and to the second conductive portion of the at least one moving part.

5. A micro-electromechanical system (MEMS) comprising:

a substrate having a plurality of metal bonding areas disposed on the an upper surface of the substrate;

at least one moving part;

at least one anchor fixed on the substrate;

at least one spring; and

an insulating layer disposed in the at least one moving part, the at least one anchor and the at least one spring, wherein the at least one moving part is divided into a first conductive portion and a second conductive portion by the insulating layer, the at least one anchor is divided into a first conductive portion and a second conductive portion by the insulating layer, and the at least one spring is divided into a first conductive portion and a second conductive portion by the insulating layer,

wherein the at least one anchor comprises at least one first insulating portion and at least one conductive pillar, the second conductive portion of the at least one anchor is divided into an outer conductive portion and an inner conductive portion by the at least one first insulating portion, the at least one conductive pillar is connected to the outer conductive portion and the first conductive portion of the at least one anchor, and the outer conductive portion and the inner conductive portion of the at least one anchor are respectively fixed on the metal bonding areas that are spaced apart;

wherein the first conductive portion of the at least one spring is connected to the first conductive portion of the at least one anchor;

wherein the second conductive portion of the at least one spring is connected to the inner conductive portion of the at least one anchor.

6. The MEMS device of claim 5, wherein the at least one moving part comprises a first moving part and a second moving part.

7. The MEMS device of claim 6, wherein the first moving part has at least one second insulating portion, and the second conductive portion of the first moving part is divided into an outer conductive portion and inner conductive portion by the at least one second insulating portion.

8. The MEMS device of claim 7, wherein the outer conductive portion of the first moving part is connected to the second conductive portion of the second moving part by the second conductive portion of the at least one spring, and the first conductive portion of the first moving part is connected to the first conductive portion of the second moving part by the first conductive portion of the at least one spring.

9. The MEMS device of claim 6, wherein the second moving part has at least one second insulating portion, and the second conductive portion of the second moving part is divided into an outer conductive portion and an inner conductive portion by the at least one second insulating portion.

10. The MEMS device of claim 9, wherein the inner conductive portion of the second moving part is connected to the second conductive portion of the first moving part by the second conductive portion of the at least one spring, and the first conductive portion of the second moving part is connected to the first conductive portion of the first moving part by the first conductive portion of the at least one spring.

11. The MEMS device of claim 6, wherein the first moving part has at least one conductive pillar connected to the first conductive portion of the first moving part and the second conductive portion of the first moving part.

12. The MEMS device of claim 6, wherein the second moving part has at least one conductive pillar connected to the first conductive portion of the second moving part and the second conductive portion of the second moving part.

13. The MEMS device of claim 6, wherein the second moving part is a frame arranged around the first moving part.

14. The MEMS device of claim 7, wherein the at least one second insulating portion of the first moving part is a trench or an insulating wall formed by electrical insulating material.

15. The MEMS device of claim 9, wherein the at least one second insulating portion of the second moving part is a trench or an insulating wall formed by electrical insulating material.

16. A micro-electromechanical system (MEMS) comprising:

a substrate including a plurality of metal bonding areas disposed on an upper surface of the substrate;

at least one first moving part;

at least one second moving part;

at least one anchor;

at least one first spring;

at least one second spring; and

an insulating layer disposed in the at least one first moving part, the at least one second moving part, the at least one anchor, the at least one first spring and the at least one second spring, wherein the at least one first moving part is divided into a first conductive portion and a second conductive portion by the insulating layer, the at least one second moving part is divided into a first conductive portion and a second conductive portion by the insulating layer, the at least one anchor is divided into a first conductive portion and a second conductive portion by the insulating layer, the at least one first spring is divided into a first conductive portion and a second conductive portion by the insulating layer and the at least one second spring is divided into a first conductive portion and a second conductive portion by the insulating layer;

wherein the first conductive portion of the at least one first spring is connected to the first conductive portion of the at least one first moving part and the first conductive portion of the at least one second moving part, and the first conductive portion of the at least one second spring is connected to the first conductive portion of the at least one second moving part and to the first conductive portion of the at least one anchor;

wherein the at least one first moving part comprises at least one conductive pillar connected to the first conductive portion of the at least one first moving part and to the second conductive portion of the at least one first moving part;

wherein the at least one anchor comprises at least one first insulating portion and at least one conductive pillar, the second conductive portion of the at least one anchor is divided into an outer conductive portion and an inner conductive portion by the at least one first insulating portion, the at least one conductive pillar is connected to the outer conductive portion and the first conductive portion of the at least one anchor, and the outer conductive portion and the inner conductive portion of the at least one anchor are respectively fixed on the plurality of metal bonding areas that are spaced apart;

wherein the at least one second moving part has a second insulating portion, the second conductive portion of the at least one second moving part is divided into an outer conductive portion and an inner conductive portion by the second insulating portion;

wherein the second conductive portion of the at least one first spring is connected to the second conductive portion of the at least one first moving part and to the inner conductive portion of the at least one second moving part; and

wherein the second conductive portion of the at least one second spring is connected to the outer conductive portion of the at least one second moving part and the inner conductive portion of the at least one anchor.

17. The MEMS device of claim 16, wherein the first insulating portion of the at least one anchor is a trench or an insulating wall formed by electrical insulating material, and the second insulating portion of the at least one second moving part is a trench or an insulating wall formed by electrical insulating material.

18. The MEMS device of claim 16, wherein the at least one second moving part is a frame arranged around the at least one first moving part.