Analyte sensor and fabrication methods
First Claim
1. A method for fabricating a flexible electrochemical sensor component comprising:
- providing a substrate;
depositing a release layer on substantially all the substrate;
depositing a first flexible dielectric layer on substantially all of the release layer;
forming a plurality of individual continuously connected electrodes, traces and contact pads comprised of a conductive material over the first flexible dielectric layer;
depositing a second flexible dielectric layer over the first flexible dielectric layer and the plurality of individual continuously connected electrodes, traces and contact pads;
forming openings in the second flexible dielectric layer exposing at least a portion of at least one of the individual continuously connected electrodes and contact pads; and
removing the release layer between the first flexible dielectric material and the substrate, whereby the flexible electrochemical sensor component is released from the substrate.
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Accused Products
Abstract
Methods for fabricating analyte sensor components using IC- or MEMs-based fabrication techniques and sensors prepared therefrom. Fabrication of the analyte sensor component comprises providing an inorganic substrate having deposited thereon a release layer, a first flexible dielectric layer and a second flexible dielectric layer insulating there between electrodes, contact pads and traces connecting the electrodes and the contact pads of a plurality of sensors. Openings are provided in one of the dielectric layers over one or more of the electrodes to receive an analyte sensing membrane for the detection of an analyte of interest and for electrical connection with external electronics. The plurality of fabricated sensor components are lifted off the inorganic substrate.
56 Citations
8 Claims
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1. A method for fabricating a flexible electrochemical sensor component comprising:
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providing a substrate; depositing a release layer on substantially all the substrate; depositing a first flexible dielectric layer on substantially all of the release layer; forming a plurality of individual continuously connected electrodes, traces and contact pads comprised of a conductive material over the first flexible dielectric layer; depositing a second flexible dielectric layer over the first flexible dielectric layer and the plurality of individual continuously connected electrodes, traces and contact pads; forming openings in the second flexible dielectric layer exposing at least a portion of at least one of the individual continuously connected electrodes and contact pads; and removing the release layer between the first flexible dielectric material and the substrate, whereby the flexible electrochemical sensor component is released from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification