Miniature MEMS condenser microphone packages and fabrication method thereof

• US 8,697,470 B2
• Filed: 10/31/2012
• Issued: 04/15/2014
• Est. Priority Date: 01/20/2009
• Status: Active Grant

• Current Assignee: Neomems Technologies, Inc.
• Original Assignee: General Motors Corporation (Motors Liquidation Co. GUC Trust)
• Inventors: Wang, Yunlong
• Primary Examiner(s): Patel, Reema
• Application Number:
  US13/664,449
• Publication Number:
  US 20130059409A1
• Time in Patent Office: 531 Days
• Field of Search: 438/51, 438/50, 438/53, 381/175, 381/369
• US Class Current: 438/51
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 2201/10083 Electromechanical or electro-acoustic component, e.g. microphone
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

MEMS microphone packages and fabrication methods thereof are disclosed. One method for fabricating a MEMS microphone package, includes providing a substrate, forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part, forming a MEMS sensing element and an IC chip inside the cavity, forming an opening comprising an acoustic passage connecting the cavity to an ambient space, and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.

Claims

1. A method for fabricating a MEMS microphone package, comprising:

providing a substrate;

forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part;

forming a MEMS sensing element and an IC chip inside the cavity;

forming an opening comprising an acoustic passage connecting the cavity to an ambient space;

forming a conductive casing enclosing the top cover part and the housing wall,

wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board; and

forming an acoustic absorption layer sandwiched between the conductive casing and the cavity.

2. The method as claimed in claim 1, wherein the top cover part and the housing wall part are non-conductive.

3. The method as claimed in claim 1, wherein the acoustic absorption layer comprises a viscoelastic material.

4. The method as claimed in claim 1, wherein the opening is formed in and extended through the top cover part, and wherein an acoustic opening formed in the conductive casing is aligned with the opening to allow acoustic signals to pass therethrough.

5. The method as claimed in claim 1, wherein the opening is formed in and extended through the substrate, and wherein an acoustic opening formed in and extended through the PCB board is aligned with the opening to allow acoustic signals to pass therethrough.

6. The method as claimed in claim 5, wherein the MEMS sensing element is disposed on one end of the opening.

7. The method as claimed in claim 6, further comprising providing a perforated plate interposed between the one end of the opening and the MEMS sensing element.

8. The method as claimed in claim 5, further comprising forming an acoustical sealer surrounding the opening and interposed between the substrate and the PCB board.

9. The method as claimed in claim 1, further comprising isolating the conductive casing from a ground lead of the microphone package.

10. The method as claimed in claim 1, wherein the housing wall part and the top cover member are made of an integral single cap.

11. The method as claimed in claim 1, further comprising disposing at least one passive element inside the cavity.

12. The method as claimed in claim 1, wherein the MEMS sensing element comprises a micromachined MEMS microphone.